參數(shù)資料
型號： 2MBI800UG-170
廠商： FUJI ELECTRIC HOLDINGS CO., LTD.
英文描述： IGBT MODULE
中文描述： IGBT模塊
文件頁數(shù)： 5/13頁
文件大?。?/td> 477K
代理商： 2MBI800UG-170
H04-004-03a
MS5F5924
13
5
5. Thermal resistance characteristics
* This is the value which is defined mounting on the additional cooling fin with thermal compound.
6. Indication on module
Logo of production
Sample.No.
Place of manufacturing (code)
7.Applicable category
This specification is applied to IGBT Module named 2MBI800UG-170 .
8.Storage and transportation notes
The module should be stored at a standard temperature of 5 to 35°C and humidity of 45 to 75% .
Store modules in a place with few temperature changes in order to avoid condensation on the module surface.
Avoid exposure to corrosive gases and dust.
Avoid excessive external force on the module.
Store modules with unprocessed terminals.
Do not drop or otherwise shock the modules when transporting.
9. Definitions of switching time
10. Packing and Labeling
Display on the packing box
- Logo of production
- Type name
- Lot No
- Products quantity in a packing box
Items
Symbols
Conditions
Characteristics
typ.
-
-
0.006
Units
min.
-
-
max.
0.032
0.064
IGBT
FWD
with Thermal Compound (*)
-
Thermal resistance(1device)
Contact Thermal resistance(1device)
Rth(j-c)
Rth(c-f)
-
Lot.No.
°C/W
800A / 1700V
2MBI800UG-170
L
Vcc
Ic
V
CE
R
G
V
GE
V
GE
V
CE
Ic
0V
0A
0V
1
0%
90%
1
0%
1
0%
90%
90%
0V
Ic
V
CE
～
～
～
～
～
～
on
on
t
r
t
r(i)
t
off
t
f
t
rr
rr
I
rr
rr
t
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