參數(shù)資料
型號: 24LC256-IT/MS
元件分類: PROM
英文描述: 32K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8
封裝: ROHS COMPLIANT, PLASTIC, MSOP-8
文件頁數(shù): 18/42頁
文件大?。?/td> 797K
代理商: 24LC256-IT/MS
2007 Microchip Technology Inc.
DS21930C-page 25
24AAXX/24LCXX/24FCXX
Note:
Temperature range (T) listed on second line. I = Industrial, E = Extended
8-Lead DFN
Example
:
XXXXXXX
T/XXXXX
YYWW
24AA128
I/MF
0528
1L7
NNN
3
e
8-Lead 5x6mm DFN Package Marking
Device
Line 1
Marking
Device
Line 1
Marking
Device
Line 1
Marking
24AA128
24LC128
24FC128
24AA256
24LC256
24FC256
24AA512
24LC512
24FC512
Legend: XX...X
Part number or part number code
Y
Year code (last digit of calendar year)
YY
Year code (last 2 digits of calendar year)
WW
Week code (week of January 1 is week ‘01’)
NNN
Alphanumeric traceability code (2 characters for small packages)
Pb-free JEDEC designator for Matte Tin (Sn) plated devices
Note:
For very small packages with no room for the Pb-free JEDEC designator
, the marking will only appear on the outer carton or reel label.
Note:
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
24LC256SC/S15K 制造商:Microchip Technology Inc 功能描述:256K I2C SMARTCARD EE DIE IN WAFFLE PK - Gel-pak, waffle pack, wafer, diced wafer on film
24LC256SC/W15K 制造商:Microchip Technology Inc 功能描述:256K I2C SMARTCARD EE WAFER - Gel-pak, waffle pack, wafer, diced wafer on film
24LC256SC/WF15K 制造商:Microchip Technology Inc 功能描述:256K I2C SMARTCARD EE WFR ON FR - Gel-pak, waffle pack, wafer, diced wafer on film
24LC256T-E/MF 功能描述:電可擦除可編程只讀存儲器 256K 32K X 8 2.5V SER EE EXT RoHS:否 制造商:Atmel 存儲容量:2 Kbit 組織:256 B x 8 數(shù)據(jù)保留:100 yr 最大時鐘頻率:1000 KHz 最大工作電流:6 uA 工作電源電壓:1.7 V to 5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8
24LC256T-E/MNY 功能描述:電可擦除可編程只讀存儲器 256K, 32Kx8, 2.5V SER EE, ExT RoHS:否 制造商:Atmel 存儲容量:2 Kbit 組織:256 B x 8 數(shù)據(jù)保留:100 yr 最大時鐘頻率:1000 KHz 最大工作電流:6 uA 工作電源電壓:1.7 V to 5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8