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| 型號(hào)： | 21085 |
| 英文描述： | AMD-K6 Processor I/O Model Application Note AMD-K6 Processor Thermal Solution Design Application Note |
| 中文描述： | 的AMD - K6處理器的I / O模型的應(yīng)用指南的AMD - K6處理器散熱解決方案設(shè)計(jì)中的應(yīng)用說明 |
| 文件頁數(shù)： | 16/22頁 |
| 文件大?。?/td> | 335K |
| 代理商： | 21085 |
8
Layout and Airflow Considerations
AMD-K6
Processor Thermal Solution Design
21085I/0—February 1999
Figure 5. Airflow for a Heatsink with Fan
Airflow Management in a System Design
Complete airflow management in a system is important. In
addition to the speed and volume of air, the path of the air is
also important. Figure 6 shows the airflow in a dual-fan system.
The fan in the front end pulls cool air into the system through
intake slots in the chassis. The power supply fan acts as an
exhaust and forces the hot air out of the chassis. The thermal
performance of the heatsink can be maximized if it is located in
the shaded area with the fins oriented parallel to the airflow
path.
Figure 6. Airflow Path in a Dual-Fan System
Airflow
Ideal areas for voltage regulator
Drive Bays
P/S
Vents
V
e
n
t
s
Fan
Fan
Main Board
Front
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