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參數(shù)資料
| 型號： | 21085 |
| 英文描述： | AMD-K6 Processor I/O Model Application Note AMD-K6 Processor Thermal Solution Design Application Note |
| 中文描述： | 的AMD - K6處理器的I / O模型的應(yīng)用指南的AMD - K6處理器散熱解決方案設(shè)計中的應(yīng)用說明 |
| 文件頁數(shù)： | 14/22頁 |
| 文件大小： | 335K |
| 代理商： | 21085 |
6
Layout and Airflow Considerations
AMD-K6
Processor Thermal Solution Design
21085I/0—February 1999
trapped beneath the heatsink during assembly. AMD
recommends the use of grease and gels as thermal interfaces.
These materials are able to maintain the lowest thermal
resistance more consistently. In general, these materials can
achieve a thermal resistance of 0.15 to 0.3°C/W.
The application of interface material, in addition to material
type, is also important. Its purpose is simply to fill microscopic
air gaps and ensure a thermally efficient path for heat transfer.
Only a thin layer of interface material is desired between the
heatsink and processor. Excessive amounts of interface
material will restrict the flow of heat to the heatsink and
thereby make the thermal solution less effective.
Due to the light weight of most heatsinks, mechanical clips are
the recommended method of attachment. In addition to
providing stability, clips provide approximately 10–15 pounds
of downward pressure on the heatsink to minimize the thermal
resistance of the thermal interface material.
Layout and Airflow Considerations
Voltage Regulator
Voltage regulators, typically power transistors, are used to
provide the core and I/O voltages to the processor. In most
designs, separate heatsinks are also required to dissipate the
heat from the power transistors. The processor heatsink fins
should be aligned parallel to the chassis airflow and the voltage
regulators as shown in Figure 4 on page 7. With this alignment,
the heat generated by the voltage regulators has minimal effect
on the processor.
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