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| 型號(hào)： | 21085 |
| 英文描述： | AMD-K6 Processor I/O Model Application Note AMD-K6 Processor Thermal Solution Design Application Note |
| 中文描述： | 的AMD - K6處理器的I / O模型的應(yīng)用指南的AMD - K6處理器散熱解決方案設(shè)計(jì)中的應(yīng)用說明 |
| 文件頁數(shù)： | 11/22頁 |
| 文件大?。?/td> | 335K |
| 代理商： | 21085 |
Thermal Solutions
3
21085I/0—February 1999
AMD-K6
Processor Thermal Solution Design
Thermal Solutions
Heatsink
Figure 1 on page 4 shows the thermal model of a processor with
a passive thermal solution. The thermal resistance of a heatsink
is determined by the heat dissipation surface area, the material
and shape of the heatsink, and the airflow volume through the
heatsink. In general, the larger the surface area the lower the
thermal resistance. Heatsink designs use fins to increase the
amount of dissipating surface area in contact with the ambient
air. A larger surface area usually results in a lower thermal
resistance. Some designs implement cross-cutting along the fins
to allow omnidirectional airflow through the heatsink.
The required thermal resistance of a heatsink (
θ
SA
) can be
calculated using the following example:
If:
T
C
=
65°C
T
A
= 45°C
P
MAX
= 29.5W
Then:
Where:
T
C
T
A
P
MAX
= Maximum power consumption
θ
CA
= Case-to-ambient thermal resistance
= Processor case temperature
= Ambient temperature
Using an interface material with a low thermal resistance of
approximately 0.20
°
C/W (i.e. thermal grease), the required
thermal resistance of the heatsink (
θ
SA
) is calculated as follows:
θ
SA
=
θ
CA
–
θ
IF
= 0.678 – 0.20 = 0.478 °C/W
Where:
θ
CA
θ
IF
θ
SA
= Case-to-ambient thermal resistance
= Interface material thermal resistance
= Sink-to-ambient thermal resistance
θ
CA
T
------------------
T
A
–
P
MAX
≤
29.5W
-----------------
0.678
°
C W
=
=
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