參數(shù)資料
型號(hào)： 21085
英文描述： AMD-K6 Processor I/O Model Application Note AMD-K6 Processor Thermal Solution Design Application Note
中文描述： 的AMD - K6處理器的I / O模型的應(yīng)用指南的AMD - K6處理器散熱解決方案設(shè)計(jì)中的應(yīng)用說(shuō)明
文件頁(yè)數(shù)： 15/22頁(yè)
文件大小： 335K
代理商： 21085
Layout and Airflow Considerations
7
21085I/0—February 1999
AMD-K6
Processor Thermal Solution Design
Figure 4. Voltage Regulator Placement
Heatsink and Fan
A heatsink and fan combination, or fansink, can deliver even
better thermal performance than a heatsink alone. More
importantly, airflow requirements in a system design are not as
critical with a fansink. The fan pulls air from above the fan,
through the heatsink, and out the heatsink sides. When using a
fansink solution, the best location for the voltage regulators is
on the side of the processor, in the path of the air exiting the
fansink (See Figure 5 on page 8). Such a location guarantees
that the heatsinks on both the processor and the regulator
receive adequate airflow.
Fansinks are more effective when the following design
techniques are employed:
I
To avoid impeding airflow within the chassis to the fansink,
route ribbon cables between the system motherboard and
chassis drive bays.
To provide a sufficient volume of air to the fansink, maintain
a 1/2 inch clearance above the fansink.
I
Heatsink Fins Aligned
With Airflow
Airflow
Voltage Regulator (V
CC
Core)
Voltage Regulator (V
CC
I/O)
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