XRD54L08/L10/L12
5
Rev. 1.30
ELECTRICAL CHARACTERISTICS (CONT’D)
Test Conditions: VDD= 3V, GND= 0V, REFIN= 1.000V (External), RL= 10kW, CL= 100pF, TA= TMIN to TMAX,
Unless Otherwise Noted.
Symbol
Parameter
Min.
Typ.
Max.
Unit
Conditions
tCH
SCLK High Width
20
35
ns
tCL
SCLK Low Width
20
35
ns
tDS
DIN Setup Time
10
45
ns
tDH
DIN Hold Time
0
ns
tDO
DOUT Valid Propagation Delay
8
15
ns
CL= 50pF
tCSW
CS High Pulse Width
20
40
ns
tCS1
CS Rise to SCLK Rise Setup
Time
10
20
ns
Specifications are subject to change without notice
ABSOLUTE MAXIMUM RATINGS
VDD to GND
-0.3V, +5V
. . . . . . . . . . . . . . . . . . . . . . . . . .
Digital Input Voltage to GND
-0.3V, VDD +0.3V
. . . . . .
VREFIN
-0.3V, VDD +0.3V
. . . . . . . . . . . . . . . . . . . . . . . . .
VOUT1
VDD, GND
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous Current, Any Pin
-20mA, +20mA
. . . . . . . .
Package Power Dissipation Ratings (TA= +70°C)
PDIP (derate 9mW/°C above +70°C)
117mW
. . . .
SOIC (derate 6mW/°C above +70°C)
155mW
. . .
Operating Temperature Range
-40°C to + 85°C
. . . . .
Storage Temperature Range
-65°C to +165°C
. . . . . .
Lead Temperature (soldering, 10 sec)
+300°C
. . . . . .
Notes
1 Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a
stress rating only and functional operation at or above this specification is not implied. Exposure to maximum rating
conditions for extended periods may affect device reliability.
2 Any input pin which can see a value outside the absolute maximum ratings should be protected by Schottky diode clamps
(HP5082-2835) from input pin to the supplies. All inputs have protection diodes which will protect the device from short
transients outside the supplies of less than 100mA for less than 100ms.