參數(shù)資料
型號： XPC855TZP80
英文描述： Controller Miscellaneous - Datasheet Reference
中文描述： 控制器雜項(xiàng)-數(shù)據(jù)表參考
文件頁數(shù)： 9/76頁
文件大?。?/td> 825K
代理商： XPC855TZP80
MOTOROLA
MPC850 (Rev. A/B/C) Hardware Specifications
9
Part IV Thermal Characteristics
Table 4-3 shows the thermal characteristics for the MPC850.
Table 4-4 provides power dissipation information.
Table 4-5 provides the DC electrical characteristics for the MPC850.
Table 4-5. DC Electrical Specifications
Table 4-3. Thermal Characteristics
Characteristic
Symbol
Value
Unit
Thermal resistance for BGA
1
1
For more information on the design of thermal vias on multilayer boards and BGA layout considerations in
general, refer to AN-1231/D,
Plastic Ball Grid Array Application Note
office.
Assumes natural convection and a single layer board (no thermal vias).
Assumes natural convection, a multilayer board with thermal vias
temperature rise of 20
°
C above ambient.
Assumes natural convection, a multilayer board with thermal vias
temperature rise of 13
°
C above ambient.
T
J
= T
A
+ (P
D
P
D
= (V
DD
where:
P
I/O
is the power dissipation on pins
available from your local Motorola sales
θ
JA
40
2
2
3
°
C/W
θ
JA
31
3
4
, 1 watt MPC850 dissipation, and a board
°
C/W
θ
JA
24
4
4
4
, 1 watt MPC850 dissipation, and a board
θ
JA
DD
)
) + P
I
I/O
°
C/W
Thermal Resistance for BGA (junction-to-case)
θ
JC
8
°
C/W
Table 4-4. Power Dissipation (P
D
)
Characteristic
Frequency (MHz)
Typical
1
1
Typical power dissipation is measured at 3.3V
Maximum power dissipation is measured at 3.65 V
Maximum
2
2
Unit
Power Dissipation
All Revisions
(1:1) Mode
33
TBD
515
mW
40
TBD
590
mW
50
TBD
725
mW
Characteristic
Symbol
Min
Max
Unit
Operating voltage at 40 MHz or less
VDDH, VDDL,
KAPWR, VDDSYN
3.0
3.6
V
Operating voltage at 40 MHz or higher
VDDH, VDDL,
KAPWR, VDDSYN
3.135
3.465
V
Input high voltage (address bus, data bus, EXTAL, EXTCLK,
and all bus control/status signals)
VIH
2.0
3.6
V
Input high voltage (all general purpose I/O and peripheral pins)
VIH
2.0
5.5
V
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