參數(shù)資料
型號(hào): XPC855TZP80
英文描述: Controller Miscellaneous - Datasheet Reference
中文描述: 控制器雜項(xiàng)-數(shù)據(jù)表參考
文件頁數(shù): 71/76頁
文件大?。?/td> 825K
代理商: XPC855TZP80
71
MPC850 (Rev. A/B/C) Hardware Specifications
MOTOROLA
Pin Assignments and Mechanical Dimensions of the PBGA
Figure 9-65 shows the JEDEC package dimensions of the PBGA.
Figure 9-65. Package Dimensions for the Plastic Ball Grid Array (PBGA)—JEDEC
Standard
U
T
B
C
D
E
F
G
H
J
K
L
M
N
P
R
256X
BOTTOM VIEW
E
0.20
7
6
5
4
3
2
b
0.30
0.15
C
D
D2
E2
A
B
C A B
SIDE VIEW
DIM
A
A1
A2
A3
b
D
D1
D2
E
E1
E2
e
MIN
1.91
0.50
1.12
0.29
0.60
23.00 BSC
19.05 REF
19.00
MAX
2.35
0.70
1.22
0.43
0.90
MILLIMETERS
23.00 BSC
19.05 REF
19.00
1.27 BSC
20.00
NOTES:
1.
DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
DIMENSIONS IN MILLIMETERS.
DIMENSION b IS MEASURED AT THE MAXIMUM
SOLDER BALL DIAMETER, PARALLEL TO PRIMARY
DATUM C.
PRIMARY DATUM C AND THE SEATING PLANE ARE
DEFINED BY THE SPHERICAL CROWNS OF THE
SOLDER BALLS.
2.
3.
4.
4X
8 9 10111213141516
M
M
TOP VIEW
(D1)
15X
e
15X
e
(E1)
4X
e /2
0.20 C
0.35 C
A3
256X
C
A
A1
A2
PLANE
20.00
17
CASE 1130-01
ISSUE B
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