參數資料
型號: XCS30-4TQ100C
廠商: Xilinx, Inc.
英文描述: Spartan and Spartan-XL Families Field Programmable Gate Arrays
中文描述: 斯巴達和Spartan - xL的家庭現場可編程門陣列
文件頁數: 26/82頁
文件大?。?/td> 623K
代理商: XCS30-4TQ100C
Spartan and Spartan-XL Families Field Programmable Gate Arrays
26
www.xilinx.com
1-800-255-7778
DS060 (v1.6) September 19, 2001
Product Specification
R
During configuration, some of the I/O pins are used tempo-
rarily for the configuration process. All pins used during con-
figuration are shown in
Table 14
and
Table 15
.
Table 14:
Pin Functions During Configuration
(Spartan family only)
Configuration Mode (MODE Pin)
User
Operation
Slave Serial
(High)
Master Serial
(Low)
MODE (I)
MODE (I)
MODE
HDC (High)
HDC (High)
I/O
LDC (Low)
LDC (Low)
I/O
INIT
INIT
I/O
DONE
DONE
DONE
PROGRAM (I)
PROGRAM (I)
PROGRAM
CCLK (I)
CCLK (O)
CCLK (I)
DIN (I)
DIN (I)
I/O
DOUT
DOUT
SGCK4-I/O
TDI
TDI
TDI-I/O
TCK
TCK
TCK-I/O
TMS
TMS
TMS-I/O
TDO
TDO
TDO-(O)
ALL OTHERS
Notes:
1.
A shaded table cell represents the internal pull-up used
before and during configuration.
(I) represents an input; (O) represents an output.
INIT
is an open-drain output during configuration.
2.
3.
Table 15:
Pin Functions During Configuration
(Spartan-XL family only)
CONFIGURATION MODE <M1:M0>
User
Operation
Slave
Serial
[1:1]
Master
Serial
[1:0]
Express
[0:X]
M1 (High) (I)
M1 (High) (I)
M1(Low) (I)
M1
M0 (High) (I)
M0 (Low) (I)
M0 (I)
M0
HDC (High)
HDC (High)
HDC (High)
I/O
LDC (Low)
LDC (Low)
LDC (Low)
I/O
INIT
INIT
INIT
I/O
DONE
DONE
DONE
DONE
PROGRAM
(I)
PROGRAM
(I)
PROGRAM
(I)
PROGRAM
CCLK (I)
CCLK (O)
CCLK (I)
CCLK (I)
DATA 7 (I)
I/O
DATA 6 (I)
I/O
DATA 5 (I)
I/O
DATA 4 (I)
I/O
DATA 3 (I)
I/O
DATA 2 (I)
I/O
DATA 1 (I)
I/O
DIN (I)
DIN (I)
DATA 0 (I)
I/O
DOUT
DOUT
DOUT
GCK6-I/O
TDI
TDI
TDI
TDI-I/O
TCK
TCK
TCK
TCK-I/O
TMS
TMS
TMS
TMS-I/O
TDO
TDO
TDO
TDO-(O)
CS1
I/O
ALL
OTHERS
Notes:
1.
A shaded table cell represents the internal pull-up used
before and during configuration.
(I) represents an input; (O) represents an output.
INIT
is an open-drain output during configuration.
2.
3.
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