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參數(shù)資料
| 型號： | XC2S200-5FGG256C |
| 廠商： | Xilinx Inc |
| 文件頁數(shù)： | 28/99頁 |
| 文件大小： | 0K |
| 描述： | IC SPARTAN-II FPGA 200K 256-FBGA |
| 標(biāo)準包裝： | 90 |
| 系列： | Spartan®-II |
| LAB/CLB數(shù)： | 1176 |
| 邏輯元件/單元數(shù)： | 5292 |
| RAM 位總計： | 57344 |
| 輸入/輸出數(shù)： | 176 |
| 門數(shù)： | 200000 |
| 電源電壓： | 2.375 V ~ 2.625 V |
| 安裝類型： | 表面貼裝 |
| 工作溫度： | 0°C ~ 85°C |
| 封裝/外殼： | 256-BGA |
| 供應(yīng)商設(shè)備封裝： | 256-FBGA（17x17） |
| 其它名稱： | 122-1310 |
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Spartan-II FPGA Family: Functional Description
DS001-2 (v2.8) June 13, 2008
Module 2 of 4
Product Specification
34
R
Creating Larger RAM Structures
The block RAM columns have specialized routing to allow
cascading blocks together with minimal routing delays. This
achieves wider or deeper RAM structures with a smaller
timing penalty than when using normal routing channels.
Location Constraints
Block RAM instances can have LOC properties attached to
them to constrain the placement. The block RAM placement
locations are separate from the CLB location naming
convention, allowing the LOC properties to transfer easily
from array to array.
The LOC properties use the following form:
LOC = RAMB4_R#C#
RAMB4_R0C0 is the upper left RAMB4 location on the
device.
Conflict Resolution
The block RAM memory is a true dual-read/write port RAM
that allows simultaneous access of the same memory cell
from both ports. When one port writes to a given memory
cell, the other port must not address that memory cell (for a
write or a read) within the clock-to-clock setup window. The
following lists specifics of port and memory cell write conflict
resolution.
If
both
ports
write
to
the
same
memory
cell
simultaneously,
violating
the
clock-to-clock
setup
requirement, consider the data stored as invalid.
If one port attempts a read of the same memory cell
the other simultaneously writes, violating the
clock-to-clock setup requirement, the following occurs.
-
The write succeeds
-
The data out on the writing port accurately reflects
the data written.
-
The data out on the reading port is invalid.
Conflicts do not cause any physical damage.
Single Port Timing
Figure 33 shows a timing diagram for a single port of a block
RAM memory. The block RAM AC switching characteristics
are specified in the data sheet. The block RAM memory is
initially disabled.
At the first rising edge of the CLK pin, the ADDR, DI, EN,
WE, and RST pins are sampled. The EN pin is High and the
WE pin is Low indicating a read operation. The DO bus
contains the contents of the memory location, 0x00, as
indicated by the ADDR bus.
At the second rising edge of the CLK pin, the ADDR, DI, EN,
WR, and RST pins are sampled again. The EN and WE pins
are High indicating a write operation. The DO bus mirrors
the DI bus. The DI bus is written to the memory location
0x0F.
At the third rising edge of the CLK pin, the ADDR, DI, EN,
WR, and RST pins are sampled again. The EN pin is High
and the WE pin is Low indicating a read operation. The DO
bus contains the contents of the memory location 0x7E as
indicated by the ADDR bus.
At the fourth rising edge of the CLK pin, the ADDR, DI, EN,
WR, and RST pins are sampled again. The EN pin is Low
indicating that the block RAM memory is now disabled. The
DO bus retains the last value.
Dual Port Timing
Figure 34 shows a timing diagram for a true dual-port
read/write block RAM memory. The clock on port A has a
longer period than the clock on Port B. The timing
parameter TBCCS, (clock-to-clock setup) is shown on this
diagram. The parameter, TBCCS is violated once in the
diagram. All other timing parameters are identical to the
single port version shown in Figure 33.
TBCCS is only of importance when the address of both ports
are the same and at least one port is performing a write
operation. When the clock-to-clock set-up parameter is
violated for a WRITE-WRITE condition, the contents of the
memory at that location will be invalid. When the
clock-to-clock set-up parameter is violated for a
WRITE-READ condition, the contents of the memory will be
correct, but the read port will have invalid data. At the first
rising edge of the CLKA, memory location 0x00 is to be
written with the value 0xAAAA and is mirrored on the DOA
bus. The last operation of Port B was a read to the same
memory location 0x00. The DOB bus of Port B does not
change with the new value on Port A, and retains the last
read value. A short time later, Port B executes another read
to memory location 0x00, and the DOB bus now reflects the
new memory value written by Port A.
At the second rising edge of CLKA, memory location 0x7E
is written with the value 0x9999 and is mirrored on the DOA
bus. Port B then executes a read operation to the same
memory location without violating the TBCCS parameter and
the DOB reflects the new memory values written by Port A.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
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| XC2S200-5FGG256I | 功能描述:IC SPARTAN-II FPGA 200K 256-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:Spartan®-II 標(biāo)準包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA（27x27） |
| XC2S200-5FGG456C | 功能描述:IC SPARTAN-II FPGA 200K 456-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:Spartan®-II 標(biāo)準包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA（27x27） |
| XC2S200-5FGG456C4124 | 制造商:Xilinx 功能描述: |
| XC2S200-5FGG456I | 功能描述:IC SPARTAN-II FPGA 200K 456-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:Spartan®-II 標(biāo)準包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA（27x27） |
| XC2S200-5PQ208C | 功能描述:IC FPGA 2.5V 1176 CLB'S 208-PQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:Spartan®-II 標(biāo)準包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA（27x27） |
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