參數(shù)資料
型號: XC2S150-6FG456C
廠商: Xilinx Inc
文件頁數(shù): 95/99頁
文件大小: 0K
描述: IC FPGA 2.5V C-TEMP 456-FBGA
標(biāo)準(zhǔn)包裝: 60
系列: Spartan®-II
LAB/CLB數(shù): 864
邏輯元件/單元數(shù): 3888
RAM 位總計: 49152
輸入/輸出數(shù): 260
門數(shù): 150000
電源電壓: 2.375 V ~ 2.625 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 85°C
封裝/外殼: 456-BBGA
供應(yīng)商設(shè)備封裝: 456-FBGA
Spartan-II FPGA Family: Pinout Tables
DS001-4 (v2.8) June 13, 2008
Module 4 of 4
Product Specification
95
R
I, GCK0
4
P80
N8
W12
636
I/O
4
P81
N9
U12
640
I/O
4
-
V12
646
I/O
4
P82
R9
Y12
649
I/O
4
-
N10
AA12
652
I/O
4
-
W13
655
I/O
4
P83
T9
AB13
661
I/O, VREF
4
P84
P9
AA13
664
VCCO
4-
VCCO
Bank 4*
VCCO
Bank 4*
-
GND
-
P85
GND*
-
I/O
4
P86
M10
Y13
667
I/O
4
P87
R10
V13
670
I/O
4
-
AB14
673
I/O
4
-
W14
676
I/O
4
P88
P10
AA14
679
GND
-
GND*
-
I/O
4
-
V14
682
I/O
4
-
Y14
685
I/O
4
-
W15
688
I/O
4
P89
T10
AB15
691
I/O
4
P90
R11
AA15
694
VCCINT
-P91
VCCINT*VCCINT*-
VCCO
4P92
VCCO
Bank 4*
VCCO
Bank 4*
-
GND
-
P93
GND*
-
I/O
4
P94
M11
Y15
697
I/O, VREF
4
P95
T11
AB16
700
I/O
4
-
AB17
706
I/O
4
P96
N11
V15
709
GND
-
GND*
-
I/O
4
-
R12
Y16
712
I/O
4
-
AA17
715
I/O
4
-
W16
718
I/O
4
P97
P11
AB18
721
I/O, VREF
4
P98
T12
AB19
724
VCCO
4-
VCCO
Bank 4*
VCCO
Bank 4*
-
GND
-
GND*
-
I/O
4
P99
T13
Y17
727
I/O
4
-
N12
V16
730
I/O
4
-
AA18
733
XC2S200 Device Pinouts (Continued)
XC2S200 Pad Name
PQ208
FG256
FG456
Bndry
Scan
Function
Bank
I/O
4
-
W17
739
I/O, VREF
4
P100
R13
AB20
742
GND
-
GND*
-
I/O
4
-
P12
AA19
745
I/O
4
-
V17
748
I/O
4
-
Y18
751
I/O
4
P101
P13
AA20
757
I/O
4
P102
T14
W18
760
GND
-
P103
GND*
-
DONE
3
P104
R14
Y19
763
VCCO
4
P105
VCCO
Bank 4*
VCCO
Bank 4*
-
VCCO
3
P105
VCCO
Bank 3*
VCCO
Bank 3*
-
PROGRAM
-
P106
P15
W20
766
I/O (INIT)
3
P107
N15
V19
767
I/O (D7)
3
P108
N14
Y21
770
I/O
3
-
V20
776
I/O
3
-
AA22
779
I/O
3
-
T15
W21
782
GND
-
GND*
-
I/O, VREF
3
P109
M13
U20
785
I/O
3
-
U19
788
I/O
3
-
V21
794
GND
-
GND*
-
I/O
3
-
R16
T18
797
I/O
3
P110
M14
W22
800
GND
-
GND*
-
VCCO
3-
VCCO
Bank 3*
VCCO
Bank 3*
-
I/O, VREF
3
P111
L14
U21
803
I/O
3
P112
M15
T20
806
I/O
3
-
T19
809
I/O
3
-
V22
812
I/O
3
-
L12
T21
815
GND
-
GND*
-
I/O
3
P113
P16
R18
818
I/O
3
-
U22
821
I/O, VREF
3
P114
L13
R19
827
I/O (D6)
3
P115
N16
T22
830
GND
-
P116
GND*
-
XC2S200 Device Pinouts (Continued)
XC2S200 Pad Name
PQ208
FG256
FG456
Bndry
Scan
Function
Bank
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