參數(shù)資料
型號: WEDPN16M72VR-100B2I
廠商: MICROSEMI CORP-PMG MICROELECTRONICS
元件分類: DRAM
英文描述: 16M X 72 SYNCHRONOUS DRAM MODULE, 6 ns, PBGA219
封裝: 25 X 25 MM, PLASTIC, BGA-219
文件頁數(shù): 4/13頁
文件大?。?/td> 470K
代理商: WEDPN16M72VR-100B2I
12
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
WEDPN16M72VR-XB2X
January 2005
Rev. 1
PACKAGE DIMENSION: 219 PLASTIC BALL GRID ARRAY (PBGA)
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
ORDERING INFORMATION
Bottom View
*133MHz available in commercial and industrial temperatures only
1.27
(0.050)
NOM
1.27
(0.050)
NOM
19.05
(0.750)
NOM
219 x 0.762
(0.030) NOM
19.05 (0.750) NOM
0.61
(0.024)
NOM
2.03 (0.080)
MAX
25.10 (0.988) sq. MAX
WED P N 16M 72 V R - XXX B2 X
WHITE ELECTRONIC DESIGNS CORP.
PLASTIC
SDRAM
CONFIGURATION, 16M x 72
3.3V Power Supply
IMPROVEMENT MARK:
R = Registered
FREQUENCY (MHz)
133 = 133MHz*
125 = 125MHz
100 = 100MHz
PACKAGE:
B2 = 219 Plastic Ball Grid Array (PBGA), 25mm x 25mm
DEVICE GRADE:
M = Military
-55°C to +125°C
I = Industrial
-40°C to +85°C
C = Commercial
0°C to +70°C
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