參數(shù)資料
型號： UPD98404
廠商： NEC Corp.
元件分類： 通信及網(wǎng)絡
英文描述： Ultraframer DS3/E3/DS2/E2/DS1/E1/DS0
中文描述： Ultraframer DS3/E3/DS2/E2/DS1/E1/DS0
文件頁數(shù)： 32/36頁
文件大小： 201K
代理商： UPD98404
Data Sheet S11822EJ4V0DS00
32
μ
PD98404
4. RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the conditions recommended in the table below.
For detail of recommended soldering conditions, refer to the information document
“Semiconductor Device
Mounting Technology Manual” (C10535E).
For soldering methods and conditions other than those recommended below, contact our sales personnel.
Surface Mount Type Soldering Conditions
μ
PD98404GJ-KEU: 144-pin plastic QFP (fine pitch) (20
×
20 mm)
Soldering method
Soldering conditions
Recommended
soldering code
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 seconds max. (at 210
°
C or higher),
Count: two times or less
Exposure limit: 3 days
Note
(after that, prebake at 125
°
C for 20 hours)
IR35-203-2
Partial heating
Pin temperature: 300
°
C max., Duration: 3 seconds max. (per device side)
–
Note
After opening the dry pack, store it at 25
°
C or less and 65% RH or less for the allowable storage period.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
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