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參數(shù)資料
| 型號： | UPD78C12AGQ |
| 廠商： | NEC Corp. |
| 英文描述： | 8-BIT SINGLE-CHIP MICROCOMPUTER WITH A/D CONVERTER |
| 中文描述： | 8位單片機與A / D轉換 |
| 文件頁數(shù)： | 60/66頁 |
| 文件大?。?/td> | 3252K |
| 代理商： | UPD78C12AGQ |
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60
μ
PD78C10A, 78C11A, 78C12A
#
10. RECOMMENDED SOLDERING CONDITIONS
The
μ
PD78C10A, 78C11A, and 78C12A should be soldered and mounted under the conditions recommended in
the table below.
For detail of recommended soldering conditions, refer to the information document
"Semiconductor Device
Mounting Technology Manual" (IEI-1207).
For soldering methods and conditions other than those recommended below, contact our sales personnel.
Table 10-1 Surface Mounting Type Soldering Conditions
(1)
μ
PD78C10AGF-3BE
μ
PD78C11AGF-
×××
-3BE : 64-pin plastic QFP (14
×
20 mm)
μ
PD78C12AGF-
×××
-3BE : 64-pin plastic QFP (14
×
20 mm)
: 64-pin plastic QFP (14
×
20 mm)
Soldering Conditions
Soldering Method
Infrared reflow
Package peak temperature : 235
°
C, Duration : 30 sec. max. (210
°
C min.), Number of times : 2 max.
<Points to note>
(1) Start the second reflow after the device temperature by the first
reflow returns to normal.
(2) Flux washing by the water after the first reflow should be avoided.
Recommended
Condition Symbol
Package peak temperature : 215
°
C, Duration : 40 sec. max. (200
°
C min.), Number of times : 2 max.
<Points to note>
(1) Start the second reflow after the device temperature by the first
reflow returns to normal.
(2) Flux washing by the water after the first reflow should be avoided.
Solder bath temperature : 260
°
C max., Duration : 10 sec. max.,
Number of times : 1
Pre-heating temperature : 120
°
C max. (package surface tempera-
ture)
WS60-00-1
VP15-00-2
IR35-00-2
VPS
Wave soldering
Pin temperature : 300
°
C max.,
Duration: 3 sec. max. (per device side)
Pin part heating
(2)
μ
PD78C10AL
μ
PD78C11AL-
×××
μ
PD78C12AL-
×××
:
:
:
68-pin plastic QFJ ( 950 mil)
68-pin plastic QFJ ( 950 mil)
68-pin plastic QFJ ( 950 mil)
Recommended
Condition Symbol
Package peak temperature : 230
°
C, Duration : 30 sec. max.
(210
°
C min.), Number of times : 1
IR30-00-1
Package peak temperature : 215
°
C, Duration : 40 sec. max.
(200
°
C min.), Number of times : 1
VP15-00-1
Pin temperature : 300
°
C max., Duration : 3 sec. max. (per device
side)
Infrared reflow
VPS
Pin part heating
Soldering Method
Soldering Conditions
Caution
Do not use two or more soldering methods in combination (except the pin part heating method).
Caution
Do not use two or more soldering methods in combination (except the pin part heating method).
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