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參數(shù)資料
| 型號(hào)： | UPD780701Y |
| 廠商： | NEC Corp. |
| 元件分類： | 8位微控制器 |
| 英文描述： | 8-bit Microcontroller with 2/4/8K Bytes In-System Programmable Flash |
| 中文描述： | 8位微控制器與2/4/8K字節(jié)在系統(tǒng)可編程閃存 |
| 文件頁(yè)數(shù)： | 53/66頁(yè) |
| 文件大?。?/td> | 565K |
| 代理商： | UPD780701Y |
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μ
PD78F0034A, 78F0034AY
53
Data Sheet U14040EJ4V0DS
Table 9-1. Surface Mounting Type Soldering Conditions (2/2)
(3)
μ
PD78F0034AGK-9ET: 64-pin plastic TQFP (12
×
12)
μ
PD78F0034AYGK-9ET: 64-pin plastic TQFP (12
×
12)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 seconds max. (at 210
°
C or higher),
Count: Two times or less,
Exposure limit: 7 days
Note
(after 7 days, prebake at 125
°
C for 10 hours)
IR35-107-2
VPS
Package peak temperature: 215
°
C, Time: 40 seconds max. (at 200
°
C or higher),
Count: Two times or less,
Exposure limit: 7 days
Note
(after 7 days, prebake at 125
°
C for 10 hours)
VP15-107-2
Wave soldering
Solder bath temperature: 260
°
C max., Time: 10 seconds max.,
Count: Once, Preheating temperature: 120
°
C max. (package surface temperature),
Exposure limit: 7 days
Note
(after 7 days, prebake at 125
°
C for 10 hours)
WS60-107-1
Partial heating
Pin temperature: 300
°
C max., Time: 3 seconds max. (per pin row)
–
Note
After opening the dry pack, store it at 25
°
C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
Table 9-2. Insertion Type Soldering Conditions
μ
PD78F0034ACW: 64-pin plastic SDIP (19.05 mm (750))
μ
PD78F0034AYCW: 64-pin plastic SDIP (19.05 mm (750))
Soldering Method
Soldering Conditions
Wave soldering (pin only)
Solder bath temperature: 260
°
C max., Time: 10 seconds max.
Partial heating
Pin temperature: 300
°
C max., Time: 3 seconds max. (per pin row)
Caution Apply wave soldering only to the pins and be careful not to bring solder into direct contact with
the package.
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