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參數(shù)資料
| 型號： | UPD780701Y |
| 廠商： | NEC Corp. |
| 元件分類： | 8位微控制器 |
| 英文描述： | 8-bit Microcontroller with 2/4/8K Bytes In-System Programmable Flash |
| 中文描述： | 8位微控制器與2/4/8K字節(jié)在系統(tǒng)可編程閃存 |
| 文件頁數(shù)： | 52/66頁 |
| 文件大?。?/td> | 565K |
| 代理商： | UPD780701Y |
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μ
PD78F0034A, 78F0034AY
52
Data Sheet U14040EJ4V0DS
9. RECOMMENDED SOLDERING CONDITIONS
The
μ
PD78F0034A, 78F0034AY should be soldered and mounted under the following recommended conditions.
For details of the recommended soldering conditions, refer to the document
Semiconductor Device Mounting
Technology Manual (C10535E)
.
For soldering methods and conditions other than those recommended below, contact your NEC sales
representative.
Table 9-1. Surface Mounting Type Soldering Conditions (1/2)
(1)
μ
PD78F0034AGC-8BS: 64-pin plastic LQFP (14
×
14)
μ
PD78F0034AYGC-8BS: 64-pin plastic LQFP (14
×
14)
μ
PD78F0034AGC-AB8: 64-pin plastic QFP (14
×
14)
μ
PD78F0034AYGC-AB8: 64-pin plastic QFP (14
×
14)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 seconds max. (at 210
°
C or higher),
Count: Two times or less
IR35-00-2
VPS
Package peak temperature: 215
°
C, Time: 40 seconds max. (at 200
°
C or higher),
Count: Two times or less
VP15-00-2
Wave soldering
Solder bath temperature: 260
°
C max., Time: 10 seconds max., Count: Once,
Preheating temperature: 120
°
C max. (package surface temperature)
WS60-00-1
Partial heating
Pin temperature: 300
°
C max., Time: 3 seconds max. (per pin row)
–
Caution Do not use different soldering methods together (except for partial heating).
(2)
μ
PD78F0034AGB-8EU: 64-pin plastic LQFP (10
×
10)
μ
PD78F0034AYGB-8EU: 64-pin plastic LQFP (10
×
10)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 seconds max. (at 210
°
C or higher),
Count: Two times or less,
Exposure limit: 7 days
Note
(after 7 days, prebake at 125
°
C for 10 hours)
IR35-107-2
VPS
Package peak temperature: 215
°
C, Time: 40 seconds max. (at 200
°
C or higher),
Count: Two times or less,
Exposure limit: 7 days
Note
(after 7 days, prebake at 125
°
C for 10 hours)
VP15-107-2
Partial heating
Pin temperature: 300
°
C max., Time: 3 seconds max. (per pin row)
–
Note
After opening the dry pack, store it at 25
°
C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
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|---|---|
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| UPD78076GF-064-3BA-A | 制造商:Renesas Electronics Corporation 功能描述: |
| UPD78082GB-A68-3BS-MTX-A | 制造商:Renesas Electronics Corporation 功能描述: |
| UPD78082GB-B44-3BS-MTX-A | 制造商:Renesas Electronics Corporation 功能描述: |
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