參數(shù)資料
型號(hào): UPD754264
廠(chǎng)商: NEC Corp.
英文描述: 4-BIT SINGLE-CHIP MICROCONTROLLERS
中文描述: 4位單晶片微控制器
文件頁(yè)數(shù): 59/68頁(yè)
文件大小: 318K
代理商: UPD754264
59
μ
PD754264
16. RECOMMENDED SOLDERING CONDITIONS
Solder the
μ
PD754264 under the following recommended conditions.
For the details on the recommended soldering conditions, refer to the Information Document
Semiconductor
Device Mounting Technology Manual (C10535E)
.
For the soldering method and conditions other than those recommended, consult an NEC representative.
Table 16-1. Soldering Conditions of Surface Mount Type
μ
PD754264GS-
×××
-BA5: 20-pin plastic SOP (300 mil, 1.27-mm pitch)
Soldering Method
Soldering Conditions
Symbol
Infrared ray reflow
Package peak temperature: 235
°
C, Reflow time: 30 seconds max. (210
°
C min.),
Number of reflow process: 2 max.
Exposure limit: 7 days
Note
(afterward, 10-hour pre-baking at 125
°
C is required)
IR35-107-2
VPS
Package peak temperature: 215
°
C, Reflow time: 40 seconds max. (200
°
C min.),
Number of reflow process: 2 max.
Exposure limit: 7 days
Note
(afterward, 10-hour pre-baking at 125
°
C is required)
VP15-107-2
Wave soldering
Solder bath temperature: 260
°
C max., Flow time: 10 seconds max.,
Number of flow process: 1
Preheating temperature: 120
°
C max. (package surface temperature)
Exposure limit: 7 days
Note
(afterward, 10-hour pre-baking at 125
°
C is required)
WS65-107-1
Partial heating
Pin temperature: 300
°
C max., Time: 3 seconds max. (per side of device)
Note
Maximum number of days during which the product can be stored at a temperature of 25
°
C and a relative
humidity of 65% or less after dry-pack package is opened.
Caution
Do not use different soldering methods together (except for partial heating).
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