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參數(shù)資料
| 型號： | UPD75117HGK |
| 廠商： | NEC Corp. |
| 英文描述： | 4-BIT SINGLE-CHIP MICROCOMPUTER |
| 中文描述： | 4位單片機 |
| 文件頁數(shù)： | 59/66頁 |
| 文件大?。?/td> | 472K |
| 代理商： | UPD75117HGK |
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59
μ
PD75116H,75117H
14. RECOMMENDED SOLDERING CONDITIONS
The
μ
PD75117H should be soldered and mounted under the conditions recommended in the table below.
For details of recommended conditions, refer to
the information document "Semiconductor Device Mount
Technology Manual" (IEI-1207)
.
For soldering methods and conditions other than those recommended below, contact our sales personnel.
Table 14-1 Surface Mount Type Soldering Conditions
(1)
μ
PD75117HGC: 64-Pin Plastic QFP ( 14 mm)
#
Recommended
Condition Symbol
Soldering Method
Soldering Conditions
Package peak temperature : 230
°
C, Duration : 30 sec. max. (at 210
°
C or
avove), Number of times : twice
<Points to note>
Flux washing by the water after the first reflow should be avoided.
Package peak temperature : 215
°
C, Duration : 40 sec. max. (at 200
°
C or
above), Number of times : twice
<Points to note>
Flux washing by the water after the first reflow should be avoided.
Solder bath temperature : 260
°
C max., Duration : 10 sec. max., Number of
times : once, Preheating temperature : 120
°
C max. (package surface
temperature)
Pin part temperature : 300
°
C max., Duration : 3 sec. max. (per device side)
Pin part heating
Wave soldering
WX60-00-1
VP15-00-2
VPS
Infrared reflow
(2)
μ
PD75117GK: 64-Pin Plastic QFP ( 12 mm)
Recommended
Condition Symbol
Soldering Method
Soldering Conditions
Package peak temperature : 230
°
C, Duration : 30 sec. max. (at 210
°
C or
avove), Number of times : twice, Time limit: 7 days
*
(thereafter 10 hours
prebaking at 125
C required)
<Points to note>
Flux washing by the water after the first reflow should be avoided.
Package peak temperature : 215
°
C, Duration : 40 sec. max. (at 200
°
C or
above), Number of times : twice, Time limit: 7 days
*
(thereafter 10 hours
prebaking at 125
C required)
<Points to note>
Flux washing by the water after the first reflow should be avoided.
Pin part temperature : 300
°
C max., Duration : 3 sec. max. (per device side)
IR30-00-2
Infrared reflow
Pin part heating
—
—
VP15-107-2
IR35-107-2
VPS
*
For the storage period after dry-pack decupsulation storage conditions are max. 25 C, 65 % RH.
Note
Use of more than one soldering method should be avoided (except in the case of pin part heating).
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