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參數(shù)資料
| 型號： | UPD75116FGF |
| 廠商： | NEC Corp. |
| 英文描述： | 4-BIT SINGLE-CHIP MICROCOMPUTER |
| 中文描述： | 4位單片機 |
| 文件頁數(shù)： | 73/78頁 |
| 文件大?。?/td> | 549K |
| 代理商： | UPD75116FGF |
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73
μ
PD75108F,75112F,75116F
15. RECOMMENDED SOLDERING CONDITIONS
The
μ
PD75116F should be soldered and mounted under the conditions recommended in the table below.
For details of recommended conditions, refer to
the information document "Semiconductor Device Mount
Technology Manual" (IEI-1207)
.
For soldering methods and conditions other than those recommended below, contact our salesman.
Table 15-1 Surface Mount Type Soldering Conditions
μ
PD75108FGF-
×××
-3BE : 64-Pin Plastic QFP (14
×
20 mm)
μ
PD75112FGF-
×××
-3BE : 64-Pin Plastic QFP (14
×
20 mm)
μ
PD75116FGF-
×××
-3BE : 64-Pin Plastic QFP (14
×
20 mm)
Recommended
Condition Symbol
Soldering Method
Soldering Conditions
Infrared reflow
VPS
Package peak temperature : 230
°
C, Duration : 30 sec. max. (at 210
°
C or
avove), Number of times : once
Package peak temperature : 215
°
C, Duration : 40 sec. max. (at 200
°
C or
above), Number of times : once
Solder bath temperature : 260
°
C max., Duration : 10 sec. max., Number of
times : once, Preheating temperature : 120
°
C max. (package surface
temperature)
Pin part temperature : 300
°
C max., Duration : 3 sec. max. (per device side)
IR30-00-1
VP15-00-1
Pin part heating
Pin part heating
Wave soldering
WS60-00-1
Note
Use of more than one soldering method should be avoided (except in the case of pin part heating).
Notice
A version of this product with improved recommended soldering conditions is
available. For details (improvements such as infrared reflow peak temperature
extension (235
°
C), number of times: twice, relaxation of time limit, etc.), contact
NEC sales personnel.
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