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參數(shù)資料
| 型號： | UPD75104GF |
| 廠商： | NEC Corp. |
| 英文描述： | 4-BIT SINGLE-CHIP MICROCOMPUTER |
| 中文描述： | 4位單片機 |
| 文件頁數(shù)： | 65/70頁 |
| 文件大?。?/td> | 535K |
| 代理商： | UPD75104GF |
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μ
PD75104, 75106, 75108
65
15. RECOMMENDED SOLDERING CONDITIONS
It is recommended that
μ
PD75104, 75106, and 75108 be soldered under the following conditions.
For details on the recommended soldering conditions, refer to Information Document "Semiconductor
Devices Mounting Manual" (IEI-616).
For other soldering methods and conditions, please consult NEC.
Table 15-1 Soldering Conditions of Surface Mount Type
μ
PD75108GF - xxx - 3BE: 64-pin plastic QFP (14 x 20 mm)
Soldering Method
Soldering Conditions
Infrared Reflow
Package peak temperature: 230
°
C, time: 30 seconds max.
(210
°
C min.), number of times: 1
Package peak temperature: 215
°
C, time: 40 seconds max.
(200
°
C min.), number of times: 1
Soldering bath temperature: 260
°
C max., time: 10 seconds
max., number of times: 1,
pre-heating temperature: 120
°
C max. (package surface
temperature)
Pin temperature: 300
°
C max.,
time: 3 seconds max. (per side)
IR30-00-1
VPS
VP15-00-1
Wave Soldering
WS60-00-1
Pin Partial Heating
—
Caution: Do not use two or more soldering methods in combination (except the pin partial heating
method).
Symbol for Recommended
Condition
Table 15-2 Soldering Conditions of Through-Hole Type
μ
PD75108CW - xxx : 64-pin plastic shrink DIP (750 mil)
Soldering Method
Soldering Conditions
Wave Soldering
(Only for lead part)
Soldering bath temperature: 260
°
C max., Time: 10 seconds max.
Pin Partial Heating
Pin temperature: 260
°
C max., Time: 10 seconds max.
Caution: The wave soldering must be performed at the lead part only. Note that the solder must not be
directly contacted to the package body.
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