參數(shù)資料
型號(hào)： UPD64
廠商： NEC Corp.
英文描述： 4-BIT SINGLE-CHIP MICROCONTROLLER FOR INFRARED REMOTE CONTROL TRANSMISSION
中文描述： 4位單片機(jī)的紅外遙控傳輸
文件頁數(shù)： 58/68頁
文件大?。?/td> 301K
代理商： UPD64
58
μ
PD63, 63A, 64
15. RECOMMENDED SOLDERING CONDITIONS
Carry out the soldered packaging of this product under the following recommended conditions.
For details of the soldering conditions, refer to information material
Semiconductor Device Mounting
Technology Manual (C10535E)
.
For soldering methods and conditions other than the recommended conditions, please consult one of our NEC
sales representatives.
Table 15-1. Soldering Conditions for Surface-Mount Type
(1)
μ
PD63GS-
×××
μ
PD63AGS-
×××
: 20-pin plastic SOP (300 mil)
μ
PD64GS-
×××
: 20-pin plastic SOP (300 mil)
: 20-pin plastic SOP (300 mil)
Soldering Method
Soldering Condition
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235
°
C; time: within 30 secs. max. (210
°
C or higher);
count: no more than twice
IR35-00-2
VPS
Package peak temperature: 215
°
C; time: 40 secs. max. (200
°
C or higher); count:
no more than twice
VP15-00-2
Wave soldering
Solder bath temperature: 260
°
C max.; time: 10 secs. max.; count: once;
Preliminary heat temperature: 120
°
C max. (Package surface temperature)
Pin temperature: 300
°
C or less ; time: 3 secs or less (for each side of the device)
WS60-00-1
Partial heating
—
Caution Using more than one soldering method should be avoided (except in the case of partial
heating).
(2)
μ
PD64MC-
×××
-5A4: 20-pin plastic SSOP (300 mil)
Soldering Method
Soldering Condition
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235
°
C; time: within 30 secs. max. (210
°
C or higher);
count: no more than three times
IR35-00-3
VPS
Package peak temperature: 215
°
C; time: 40 secs. max. (200
°
C or higher); count:
no more than three times
VP15-00-3
Wave soldering
Solder bath temperature: 260
°
C max.; time: 10 secs. max.; count: once;
Preliminary heat temperature: 120
°
C max. (Package surface temperature)
Pin temperature: 300
°
C or less ; time: 3 secs or less (for each side of the device)
WS60-00-1
Partial heating
—
Caution Using more than one soldering method should be avoided (except in the case of partial
heating).
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