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參數(shù)資料
| 型號： | UPD17P207GF-001-3B9 |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 4-BIT, OTPROM, 8 MHz, MICROCONTROLLER, PQFP80 |
| 封裝： | 14 X 20 MM, PLASTIC, QFP-80 |
| 文件頁數(shù)： | 21/34頁 |
| 文件大?。?/td> | 311K |
| 代理商： | UPD17P207GF-001-3B9 |
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PD17P207
26
6.
RECOMMENDED SOLDERING CONDITIONS
When mounting the
PD17P207 by soldering, soldering should be performed under the following recommended
contitions.
For details on recommended soldering conditions, refer to the information document “Semconductor Device
Mounting Technology Manual” (C10535E).
For other soldering methods, please cousult with NEC sales personnel.
Table 6-1.
Conditions for Surface Mounting
PD17P207GF-001-3B9 : 80-pin plastic QFP ( 14 × 20 mm)
PD17P207GF-002-3B9 : 80-pin plastic QFP ( 14 × 20 mm)
PD17P207GF-003-3B9 : 80-pin plastic QFP ( 14 × 20 mm)
Recommended
Soldering Method
Soldering Conditions
Conditions
Reference Code
Package peak temperature: 235
°C,
Time: 30 seconds max. (210
°C min.),
Infrared Reflow
Number of times: 2 max., Number of days: 7
Note (after that, prebaking is
IR35-207-2
necessary at 125
°C for 20 hours)
<Precaution>
Products other than those supplied in thermal-resistant tray (magazine,
taping, and non-thermal-resistant tray) cannot be baked in their packs.
Package peak temperature: 215
°C
Time: 40 seconds max. (200
°C min.),
VPS
Number of times: 2 max., Number of days: 7
Note (after that, prebaking is
VP15-207-2
necessary at 125
°C for 20 hours)
<Precaution>
Products other than those supplied in thermal-resistant tray (magazine,
taping, and non-thermal-resistant tray) cannot be baked in their packs.
Wave Soldering
Soldering bath temperature: 260
°C max., Time: 10 seconds max.,
WS 60-207-1
Number of times: 1
Preheating temperature: 120
°C max. (package surface temperature)
Number of days: 7
Note (after that, prebaking is necessary at 125
°C for
20 hours)
Partial Heating
Pin temperature: 300
°C max., Time: 3 seconds max. (per device)
Note
Number of days after unpacking the dry pack. Storage conditions are 25
°C and 65 %RH max.
Caution
Do not use different soldering methods together (however, pin partial heating can be performed with
other soldering methods).
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| UPD17P207GF-002 | 制造商:NEC 制造商全稱:NEC 功能描述:4-BIT SINGLE-CHIP MICROCONTROLLER WITH LCD CONTROLLER/DRIVER AND A/D CONVERTER FOR INFRARED REMOTE CONTROL TRANSMITTER |
| UPD17P207GF-002-3B9 | 制造商:NEC 制造商全稱:NEC 功能描述:4-BIT SINGLE-CHIP MICROCONTROLLER WITH LCD CONTROLLER/DRIVER AND A/D CONVERTER FOR INFRARED REMOTE CONTROL TRANSMITTER |
| UPD17P207GF-003 | 制造商:NEC 制造商全稱:NEC 功能描述:4-BIT SINGLE-CHIP MICROCONTROLLER WITH LCD CONTROLLER/DRIVER AND A/D CONVERTER FOR INFRARED REMOTE CONTROL TRANSMITTER |
| UPD17P207GF-003-3B9 | 制造商:NEC 制造商全稱:NEC 功能描述:4-BIT SINGLE-CHIP MICROCONTROLLER WITH LCD CONTROLLER/DRIVER AND A/D CONVERTER FOR INFRARED REMOTE CONTROL TRANSMITTER |
| UPD17P207GF-3B9 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:4-Bit Microcontroller |
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