μ
PD17717, 17718, 17719
10
19. BEEP ................................................................................................................................................ 338
19.1
Outline of BEEP ................................................................................................................... 338
19.2
I/O Selection Block and Output Selection Block .............................................................. 339
19.3
Clock Selection Block and Clock Generation Block ........................................................ 341
19.4
Output Waveform of BEEP ................................................................................................. 342
19.5
Status at Reset ..................................................................................................................... 342
20. STANDBY ........................................................................................................................................ 343
20.1
Outline of Standby Function............................................................................................... 343
20.2
Halt Function........................................................................................................................ 344
20.3
Clock Stop Function ............................................................................................................ 350
20.4
Device Operation in Halt and Clock Stop Status .............................................................. 352
20.5
Cautions on Processing of Each Pin in Halt and Clock Stop Status.............................. 352
20.6
Device Operation Control Function of CE Pin .................................................................. 354
21. RESET.............................................................................................................................................. 357
21.1
Outline of Reset ................................................................................................................... 357
21.2
CE Reset ............................................................................................................................... 358
21.3
Power-ON Reset................................................................................................................... 364
21.4
Relationship between CE Reset and Power-ON Reset .................................................... 367
21.5
Reset by RESET Pin ............................................................................................................ 371
21.6
WDT&SP Reset .................................................................................................................... 372
21.7
Power Failure Detection ...................................................................................................... 378
22. INSTRUCTION SET ......................................................................................................................... 383
22.1
Outline of Instruction Set .................................................................................................... 383
22.2
Legend .................................................................................................................................. 384
22.3
Instruction List ..................................................................................................................... 385
22.4
Assembler (RA17K) Embedded Macro Instruction........................................................... 387
23. RESERVED SYMBOLS ................................................................................................................... 388
23.1
Data Buffer (DBF)................................................................................................................. 388
23.2
System Registers (SYSREG) .............................................................................................. 388
23.3
Port Registers ...................................................................................................................... 389
23.4
Register File (Control Registers)........................................................................................ 391
23.5
Peripheral Hardware Registers .......................................................................................... 396
23.6
Others ................................................................................................................................... 396
24. ELECTRICAL CHARACTERISTICS (PRELIMINARY) ................................................................... 397
25. PACKAGE DRAWING ..................................................................................................................... 400
26. RECOMMENDED SOLDERING CONDITIONS............................................................................... 401
APPENDIX A. CAUTIONS ON CONNECTING CRYSTAL RESONATOR........................................... 402
APPENDIX B. DEVELOPMENT TOOLS .............................................................................................. 403