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參數(shù)資料
| 型號(hào)： | UNR-3.3/10-D12SM |
| 元件分類： | 電源模塊 |
| 英文描述： | 1-OUTPUT 33 W DC-DC REG PWR SUPPLY MODULE |
| 文件頁數(shù)： | 7/10頁 |
| 文件大?。?/td> | 239K |
| 代理商： | UNR-3.3/10-D12SM |
UNR Series
N O N - I S O L A T E D , 1 8 - 3 3 W , 5 & 1 2 V - I N P U T D C / D C C O N V E R T E R S
6
Recommended PC Board Layout
If necessary, a single pc board layout can accommodate both through-hole
and SMT models of the UNR 18-33W Series. Note that on page 2 of this
data sheet, the through-hole package is drawn with a bottom view of its pin
locations, and the surface-mount package is drawn with of top view of its
pin locations. As shown below, the through-hole pin locations, when viewed
from above, fall just inside (on 1.8 inch centers) the SMT pin locations (which
essentially begin on 2.1 inch centers). The table below shows how the pin
functions align.
4
3
2
1
8
7
6
5
9
0.10
(2.54)
0.110
(2.79)
0.100
(2.54)
0.300
(7.62)
0.500
(12.70)
TOP VIEW
1.00
(25.40)
0.800
(20.32)
4 EQ. SP. @
0.200 (5.08)
0.10
(2.54)
1
2
3
4
6
7
5
1.800
(45.72)
0.10
(2.54)
0.300
(7.62)
TOP VIEW
1.00
(25.40)
0.800
(20.32)
4 EQ. SP. @
0.200 (5.08)
PINS 1-2, 4: 0.040 ±0.002 (1.016 ±0.051)
PINS 3, 5-7: 0.062 ±0.002 (1.575 ±0.051)
Case C16A2
Case C18
+INPUT
+OUTPUT
ON/OFF CONTROL
TRIM
POWER
GROUND
4
No Pin
N.C.
3
No Pin
N.C.
2
On/Off Control
1
Logic Ground
9
7
+Input
8
6
Input Return
7
5
Output Return
6
4
Trim
5
3
+Output
SMT
Through-Hole
Pin Number
Pin Function
Figure 5. Recommended Board Layout
SMT Solder Process for SM models
For the surface-mount "SM" models of the UNR Series, the packages’ gull-
wing leads are made of tin-plated (150 microinches) copper. The gull-wing
conguration, as opposed to “J” leads, was selected to keep the solder joints
out from under the package to minimize both, heat conduction away from the
leads (into the encapsulated package) and shadowing effects.
"SM" modules do not currently withstand the standard solder-reow process
with its most common temperature proles. In order to avoid damage to the
converter a selective solder process (i.e. hot air gun or a hand soldering
method) with the following parameters must therefore be chosen :
Pre-heat phase 30-60°C rise/minute to 150°C maximum.
Lead temperature 300°C for 10 seconds maximum.
As shown in Figure 6, our tests have determined the optimal landing-pad size
to be 160 mils by 130 mils (4 x 3.3 mm).
0.130*
(3.30)
0.015
(0.38)
0.100**
(2.54)
* PAD DIMENSION
** LEAD DIMENSION
0.160*
(4.06)
0.110**
(2.79)
Figure 6 . PC Board Land Pattern
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