Philips
Semiconductors, Inc.
USB-CODEC UDA1325PS
Technical Report
DML98022
19
2.2.2 Coils at the input of the USB-bus
To meet the EMC compatibility rules,standardized by the ISO orginization, it is in some cases vital to use the
coils as shown in the schematic at the input of the USB-bus. Though, removing the coils should not affect the
functionality of the UDA1325PS in any way. It also depends on your PCB design if such countermeasures does
have any benefit or not. If you plan to use this component it is important that you use a 4-in one package coil and
not 4 physically separated coils. This is to meet the specifications given in the datasheet.
The isolators in the 4-in one packaged coil are designed to minimize the cross-over signals between the coils
which is hard to accomplish if you use 4 separate coils (depending on the placement of these coils).
Furthermore, we discovered that the TDK ZJYS – 4 is causing enumeration problems with USB-cables longer
then approx. 2 meters. It seems that there is significant difference with the one which should be inserted :
the
TDK ZJY – M4A
. Application boards of version 1.4 which are send until 1st of March ’99, have the
TDK
ZJYS – 4
which should be replaced by either shortcircuits or the
TDK ZJY – M4A
.
If you are interested in optimum protection of the USB-datalines against ESD on your application and PC
peripherals which are also attached to the Universal Serial Bus, we recommend you to use ESD protection
diodes in your application. There are several manufacturers of Surge Protection Diode Arrays which can be
used for this purpose. Some of them also provide a zener diode to protect the Vbus power supply of USB. All
these counter measures depend on which market (industry or private-sector) your product / application is
focused on and how sensitive your application is / should be towards ESD.
2.2.3 Coils at the Vdd lines of the UDA325PS
It depends on the PCB design of your application and market whether you need / want adequate
countermeasures to reduce EMI (and of course your budget). Fig. 2-12 shows how you can decrease EMI.
VSSI VDDI VSSE VDDE VSSO VDDO VSSX VDDX
+Vc +Vd +Va +Vc
Figure 2-12
EMI-countermeasure related compoments directly at the individual supply lines of the UDA1325PS
In fig 2-12, all SMD resistors should be dimensioned as 1 ohm, SMD ceramic cap’s as 100nF and SMD EMI
CHIP ferrite beads as BLM32A07. In all attempts to reduce the influence of EMC, it is important to follow the
generally applicable rules for designing PCB’s. One of the most important of these rules is to keep all copper
transmission paths as short as possible. This to reduce the antenna-effect of these lines. Please read your EMC
related documents for more information. These extra decoupling and filtering components in combination with
your specific application will help to get an EMC compatible design.