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參數(shù)資料
| 型號： | UCB1400 |
| 廠商： | NXP Semiconductors N.V. |
| 元件分類： | Codec |
| 英文描述： | Audio codec with touch screen controller and power management monitor |
| 中文描述： | 音頻編解碼器與觸摸屏控制器和電源管理監(jiān)控 |
| 文件頁數(shù)： | 59/63頁 |
| 文件大?。?/td> | 674K |
| 代理商： | UCB1400 |
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Philips Semiconductors
UCB1400
Audio codec with touch screen controller
and power management monitor
Product data
Rev. 02 — 21 June 2002
59 of 63
9397 750 09611
Koninklijke Philips Electronics N.V. 2002. All rights reserved.
20. Soldering
20.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account
of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit
Packages(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for fine
pitch SMDs. In these situations reflow soldering is recommended.
20.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling
or pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending on heating method.
Typical reflow peak temperatures range from 215 to 250
°
C. The top-surface
temperature of the packages should preferable be kept below 220
°
C for thick/large
packages, and below 235
°
C small/thin packages.
20.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging
and non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically
developed.
If wave soldering is used the following conditions must be observed for optimal
results:
Use a double-wave soldering method comprising a turbulent wave with high
upward pressure followed by a smooth laminar wave.
For packages with leads on two sides and a pitch (e):
–
larger than or equal to 1.27 mm, the footprint longitudinal axis is
preferred
to be
parallel to the transport direction of the printed-circuit board;
–
smaller than 1.27 mm, the footprint longitudinal axis
must
be parallel to the
transport direction of the printed-circuit board.
The footprint must incorporate solder thieves at the downstream end.
For packages with leads on four sides, the footprint must be placed at a 45
°
angle
to the transport direction of the printed-circuit board. The footprint must
incorporate solder thieves downstream and at the side corners.
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| UCB1400BE | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Audio codec with touch screen controller and power management monitor |
| UCB1400BE,128 | 功能描述:接口—CODEC AUDIO CODEC WITH TOUCHSCREEN RoHS:否 制造商:Texas Instruments 類型: 分辨率: 轉(zhuǎn)換速率:48 kSPs 接口類型:I2C ADC 數(shù)量:2 DAC 數(shù)量:4 工作電源電壓:1.8 V, 2.1 V, 2.3 V to 5.5 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:DSBGA-81 封裝:Reel |
| UCB1400BE,151 | 功能描述:接口—CODEC AUDIO CODEC RoHS:否 制造商:Texas Instruments 類型: 分辨率: 轉(zhuǎn)換速率:48 kSPs 接口類型:I2C ADC 數(shù)量:2 DAC 數(shù)量:4 工作電源電壓:1.8 V, 2.1 V, 2.3 V to 5.5 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:DSBGA-81 封裝:Reel |
| UCB1400BE,157 | 功能描述:接口—CODEC DO NOT USE ORDER -S OR -T PART RoHS:否 制造商:Texas Instruments 類型: 分辨率: 轉(zhuǎn)換速率:48 kSPs 接口類型:I2C ADC 數(shù)量:2 DAC 數(shù)量:4 工作電源電壓:1.8 V, 2.1 V, 2.3 V to 5.5 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:DSBGA-81 封裝:Reel |
| UCB1400BEFE | 功能描述:IC AUDIO CODEC W/TCH SCRN 48LQFP RoHS:是 類別:集成電路 (IC) >> 接口 - 編解碼器 系列:- 標準包裝:2,500 系列:- 類型:立體聲音頻 數(shù)據(jù)接口:串行 分辨率（位）:18 b ADC / DAC 數(shù)量:2 / 2 三角積分調(diào)變:是 S/N 比，標準 ADC / DAC (db):81.5 / 88 動態(tài)范圍，標準 ADC / DAC (db):82 / 87.5 電壓 - 電源，模擬:2.6 V ~ 3.3 V 電壓 - 電源，數(shù)字:1.7 V ~ 3.3 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:48-WFQFN 裸露焊盤 供應商設備封裝:48-TQFN-EP（7x7） 包裝:帶卷 (TR) |
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