參數(shù)資料
型號: TWR-MCF51CN
廠商: Freescale Semiconductor
文件頁數(shù): 5/48頁
文件大?。?/td> 0K
描述: KIT TOWER BOARD
其它有關(guān)文件: TWR-MCF51CN Schematic
產(chǎn)品培訓(xùn)模塊: MCF51CN Family - Ultimate Ethernet Solutions
Tower System
特色產(chǎn)品: The Tower System
標(biāo)準(zhǔn)包裝: 1
系列: ColdFire®, Flexis™
類型: MCU
適用于相關(guān)產(chǎn)品: Freescale 電源塔系統(tǒng),MCF51CN128
所含物品:
產(chǎn)品目錄頁面: 734 (CN2011-ZH PDF)
配用: TWR-ELEV-ND - TOWER ELEVATOR BOARDS HARDWARE
相關(guān)產(chǎn)品: MCF51CN128CLH-ND - IC MCU 32BIT 128K FLASH 64-LQFP
MCF51CN128CGT-ND - IC MCU 32BIT 128K FLASH 48-QFN
Electrical Characteristics
MCF51CN128 ColdFire Microcontroller Data Sheet, Rev. 4
Freescale Semiconductor
13
3.4
Thermal Characteristics
This section provides information about operating temperature range, power dissipation, and package thermal resistance. Power
dissipation on I/O pins is usually small compared to the power dissipation in on-chip logic and voltage regulator circuits, and
it is user-determined rather than being controlled by the MCU design. To take PI/O into account in power calculations, determine
the difference between actual pin voltage and VSS or VDD and multiply by the pin current for each I/O pin. Except in cases of
unusually high pin current (heavy loads), the difference between pin voltage and VSS or VDD will be very small.
The average chip-junction temperature (TJ) in °C can be obtained from:
TJ = TA + (PD × θJA)
Eqn. 1
where:
TA = Ambient temperature, °C
θJA = Package thermal resistance, junction-to-ambient, °C/W
PD = Pint + PI/O
Pint = IDD × VDD, Watts — chip internal power
PI/O = Power dissipation on input and output pins — user determined
For most applications, PI/O << Pint and can be neglected. An approximate relationship between PD and TJ (if PI/O is neglected)
is:
PD = K ÷ (TJ + 273°C)
Eqn. 2
Solving Equation 1 and Equation 2 for K gives:
K = PD × (TA + 273°C) + θJA × (PD)
2
Eqn. 3
where K is a constant pertaining to the particular part. K can be determined from equation 3 by measuring PD (at equilibrium)
for a known TA. Using this value of K, the values of PD and TJ can be obtained by solving Equation 1 and Equation 2 iteratively
for any value of TA.
Table 5. Thermal Characteristics
Rating
Symbol
Value
Unit
Operating temperature range
(packaged)
TA
TL to TH
(–40 to 85 or 0 to 70)1
1 Depending on device.
°C
Maximum junction temperature
TJM
95
°C
Thermal resistance
Single-layer board
48-pin QFN
θ
JA
81
°C/W
64-pin LQFP
69
80-pin LQFP
60
Thermal resistance
Four-layer board
48-pin QFN
θ
JA
26
°C/W
64-pin LQFP
50
80-pin LQFP
47
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參數(shù)描述
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