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參數(shù)資料
| 型號： | TS81102G0FS |
| 英文描述： | TS81102G0FS Summary [Updated 9/03. 10 Pages] DMUX 8/10 bit. 2 Gsps. 1:4/1:8. for military applications |
| 中文描述： | TS81102G0FS摘要[更新9 / 03。 10頁]分解器8 / 10位。 2 GSPS的。 1:4 / 1:8。軍事應(yīng)用 |
| 文件頁數(shù)： | 8/10頁 |
| 文件大?。?/td> | 239K |
| 代理商： | TS81102G0FS |
8
TS81102G0FS
5344AS–BDC–09/03
Figure 5.
Thermal Characteristics
Thermal Resistance Junction to bottom of case =
0.26 + 0.31 + 1.44 + 0.07 + 0.07 = 2.15C/Watt
(customer thermal interface excluded)
Estimated Thermal Model For 196 CQFP-CuW
Bottom of
Leads
Board at Bottom
of Leads
47.7
C/Watt
= 0.17 W/cm/C
Lid : Kovar
CuW Base
Thermal
Interface
(Customer)
CuW base
Silver Glass
= 0.2 W/cm/C
Silicon Die
7 x 7=49 mm2
heating zone =
3.5 x 3.5 mm2
0.07C/Watt
(Typical Values)
= 1.8 W/cm/C
Al2O3
= 0.17 W/cm/C
= 0.95 W/cm/C
DEMUX
CuW Base
Board at Bottom
of Package
Bottom
of Package
2.3C/Watt
Al2O3
3.0C/Watt
0.31C/Watt
1.44C/Watt
0.07C/Watt
0.26C/Watt
Silicon Junction
Lid top
0.3C/Watt
0.6C/Watt
Al2O3
Kovar Leads
127 μm x 230 μm
= 0.17 W/cm/C
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