參數(shù)資料
型號(hào): TS(X)PC603PVG8LE
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 200 MHz, RISC PROCESSOR, CBGA255
封裝: CERAMIC, BGA-255
文件頁數(shù): 34/38頁
文件大?。?/td> 599K
代理商: TS(X)PC603PVG8LE
TSPC603P
5/38
2.2. CBGA255 package
Figure 3 (pin matrix) shows the pinout as viewed from the top of the CBGA package. The direction of the top surface view is shown by
the side profile of the CBGA package.
T
B
C
D
E
F
G
H
J
K
L
R
M
N
P
01
16
15
14
13
12
11
10
09
08
07
06
05
04
03
02
A
VIEW
Substrate Assembly
Encapsulant
Die
Pin matrix top view
Not to scale
Figure 3 : CBGA 255 Top view
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