參數(shù)資料
型號: TS(X)PC603PVG8LE
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 200 MHz, RISC PROCESSOR, CBGA255
封裝: CERAMIC, BGA-255
文件頁數(shù): 10/38頁
文件大?。?/td> 599K
代理商: TS(X)PC603PVG8LE
TSPC603P
18/38
4.3. Dynamic characteristics
4.3.1. Clock AC specifications
Table 10 provides the clock AC timing specifications as defined in Figure 7.
Table 10 : Clock AC timing specifications
Vdd = AVdd = 2.5 V
± 5 % ; OVdd = 3.3 ± 5 % V dc, GND = 0 V dc, –55°C ≤ Tc ≤ 125°C
Num
Characteristics
166 MHz
200 MHz
Unit
Note
Min
Max
Min
Max
Processor frequency
125
167
125
200
MHz
5
VCO frequency
250
333
250
400
MHz
5
SYSCLK (bus) frequency
25
66.67
25
66.67
MHz
1
SYSCLK cycle time
15
40
15
40
ns
2,3
SYSCLK rise and fall time
2.0
2.0
ns
1
4
SYSCLK duty cycle (1.4V measured)
40
60
40
60
%
3
SYSCLK jitter
±150
±150
ps
2
603p internal PLL relock time
100
100
ms
3,4
Notes:
1. Rise and fall times for the SYSCLK input are measured from 0.4 V to 2.4 V.
2. Cycle-to-cycle jitter is guaranteed by design.
3. Timing is guaranteed by design and characterization, and is not tested.
4. PLL relock time is the maximum amount of time required for PLL lock after a stable Vdd and SYSCLK are reached during the power-on reset
sequence. This specification also applies when the PLL has been disabled and subsequently re-enabled during sleep mode. Also note that
HRESET must be held asserted for a minimum of 255 bus clocks after the PLL relock time (100
ms) during the power-on reset sequence.
5. Caution : The SYSCLK frequency and PLL_CFG0–PLL_CFG3 settings must be chosen such that the resulting SYSCLK (bus) frequency,
CPU (core) frequency, and PLL (VCO) frequency do not exceed their respective maximum or minimum operating frequencies. Refer to the
PLL_CFG0_PLL_CFG3 signal description for valid PLL settings.
Figure 7 : SYSCLK input timing diagram
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