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參數資料
| 型號： | TPS54611-Q1 |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | 3-V TO 6-V INPUT, 6-A OUTPUT SYNCHRONOUS BUCK PWM SWITCHER WITH INTEGRATED FETs(SWIFT) |
| 中文描述： | 3 - V至6 V輸入，6 - A輸出同步降壓PWM開關帶有集成FET協(xié)會（SWIFT） |
| 文件頁數： | 11/18頁 |
| 文件大?。?/td> | 246K |
| 代理商： | TPS54611-Q1 |
SGLS266D OCTOBER 2004 REVISED DECEMBER 2004
www.ti.com
11
GROUNDING AND POWERPAD LAYOUT
The TPS5461116 have two internal grounds (analog and
power). Inside the TPS5461116, the analog ground ties
to all of the noise sensitive signals, while the power ground
ties to the noisier power signals. The PowerPAD is tied
internally to the analog ground. Noise injected between the
two grounds can degrade the performance of the
TPS5461116, particularly at higher output currents.
However, ground noise on an analog ground plane can
also cause problems with some of the control and bias
signals. For these reasons, separate analog and power
ground planes are recommended. These two planes
should tie together directly at the IC to reduce noise
between the two grounds. The only components that
should tie directly to the power ground plane are the input
capacitor, the output capacitor, the input voltage
decoupling capacitor, and the PGND pins of the
TPS5461116. The layout of the TPS54614 evaluation
module is representative of a recommended layout for a
4-layer board. Documentation for the TPS54614
evaluation module can be found on the Texas Instruments
web site (www.ti.com) under the TPS54614 product folder.
See the TPS54614185 User’s Guide, Texas Instruments
(SLVU053) and the application note, Texas Instruments
(SLVA105).
LAYOUT CONSIDERATIONS FOR THERMAL
PERFORMANCE
For operation at full rated load current, the analog ground
plane must provide adequate heat dissipating area. A 3
inch by 3 inch plane of 1 ounce copper is recommended,
though not mandatory, depending on ambient temperature
and airflow. Most applications have larger areas of internal
ground plane available, and the PowerPAD should be
connected to the largest area available. Additional areas
on the top or bottom layers also help dissipate heat, and
any area available should be used when 3 A or greater
operation is desired. Connection from the exposes area of
the PowerPAD to the analog ground plane layer should be
made using 0.013 inch diameter vias to avoid solder
wicking through the vias. Six vias should be in the
PowerPAD area with four additional vias located under the
device package. The size of the vias under the package,
but not in the exposed thermal pad area, can be increased
to 0.018. Additional vias beyond the 10 recommended that
enhance thermal performance should be included in areas
not under the device package.
Connect Pin 1 to Analog Ground Plane
in This Area for Optimum Performance
Minimum Recommended Top
Side Analog Ground Area
0.3478
0.0150
0.06
0.0256
0.1700
0.1340
0.0630
0.0400
0.0180
4 PL
0.2090
0.0130
8 PL
Minimum Recommended Exposed
Copper Area for Powerpad. 5mm
Stencils May Require 10 Percent
Larger Area
0.0650
0.0500
0.0500
0.0650
0.0339
0.0339
0.0500
Minimum Recommended Thermal Vias: 8 x 0.013 Diameter Inside
Powerpad Area 4 x 0.018 Diameter Under Device as Shown.
Additional 0.018 Diameter Vias May Be Used if Top Side Analog Ground
Area Is Extended.
0.3820
Figure 11. Recommended Land Pattern for 28-Pin PWP PowerPAD
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相關代理商/技術參數 |
參數描述 |
|---|---|
| TPS54612 | 制造商:TI 制造商全稱:Texas Instruments 功能描述:3-V TO 6-V INPUT, 6-A OUTPUT SYNCHRONOUS BUCK PWM SWITCHER WITH INTEGRATED FETs |
| TPS54612MPWPREP | 制造商:TI 制造商全稱:Texas Instruments 功能描述:3-V TO 6-V INPUT, 6-A OUTPUT SYNCHRONOUS BUCK PWM SWITCHER WITH INTEGRATED FETs (SWIFT) |
| TPS54612PWP | 功能描述:直流/直流開關調節(jié)器 Lo-In Voltage 6A Sync Buck Converter RoHS:否 制造商:International Rectifier 最大輸入電壓:21 V 開關頻率:1.5 MHz 輸出電壓:0.5 V to 0.86 V 輸出電流:4 A 輸出端數量: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:PQFN 4 x 5 |
| TPS54612PWP | 制造商:Texas Instruments 功能描述:BUCK PWM REG FET 6A SMD 54612 |
| TPS54612PWPG4 | 功能描述:直流/直流開關調節(jié)器 Lo-In Voltage 6A Sync Buck Converter RoHS:否 制造商:International Rectifier 最大輸入電壓:21 V 開關頻率:1.5 MHz 輸出電壓:0.5 V to 0.86 V 輸出電流:4 A 輸出端數量: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:PQFN 4 x 5 |
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