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參數(shù)資料
| 型號： | TPS54377RHFTG4 |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 穩(wěn)壓器 |
| 英文描述： | 7.5 A SWITCHING REGULATOR, 1600 kHz SWITCHING FREQ-MAX, PQCC24 |
| 封裝： | 4 X 5 MM, GREEN, PLASTIC, QFN-24 |
| 文件頁數(shù)： | 2/22頁 |
| 文件大?。?/td> | 727K |
| 代理商： | TPS54377RHFTG4 |
www.ti.com
LAYOUT CONSIDERATIONS FOR THERMAL PERFORMANCE
PIN1
0.1250
0.0120
0.0900
24x
0.0320
24x
0.1182
0.0197
0.1620
0.0788
0.1220
0.0400
6x0.013DIA
EXPOSED
POWERPAD
AREA
SLVS779 – SEPTEMBER 2007
For operation at full rated load current, the analog ground plane must provide adequate heat dissipating area. A
3 inch by 3 inch plane of 1 ounce copper is recommended, though not mandatory, depending on ambient
temperature and airflow. Most applications have larger areas of internal ground plane available, and the
PowerPAD should be connected to the largest area available. Additional areas on the top or bottom layers also
help dissipate heat, and any area available should be used when 3 A or greater operation is desired. Connection
from the exposed area of the PowerPAD to the analog ground plane layer should be made using 0.013 inch
diameter vias to avoid solder wicking through the vias. Six vias should be in the PowerPAD area additional vias
located under the device package may be added to enhance thermal performance. The vias under the package,
but not in the exposed thermal pad area, can be increased in size to 0.018.
Figure 12. Recommended Land Pattern for 24-Pin QFN PowerPAD
10
Copyright 2007, Texas Instruments Incorporated
Product Folder Link(s): TPS54377
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