參數資料
型號： TPS2341PHPR
廠商： TEXAS INSTRUMENTS INC
元件分類： 電源管理
英文描述： 4-CHANNEL POWER SUPPLY SUPPORT CKT, PQFP48
封裝： POWERPAD, HTQFP-48
文件頁數： 17/31頁
文件大?。?/td> 649K
代理商： TPS2341PHPR
TPS2341
SLUS513A MAY 2003 REVISED JULY 2004
24
www.ti.com
APPLICATION INFORMATION
Thermal Model
The TPS2341 is packaged in the HTQFP-48 PowerPad
t quad flat-pack package. The PowerPad package is
a thermally enhanced standard size device package designed to eliminate the use of bulky heatsinks and slugs
traditionally used in thermal packages. This package can be easily mounted using standard printed circuit board
(PCB) assembly techniques, and can be removed and replaced using standard repair procedures.
The PowerPad package is designed so that the leadframe die pad is exposed on the bottom of the device. This
provides an extremely low thermal resistance between the die and the thermal pad. The thermal pad can be
soldered directly to the PCB for heatsinking. In addition, through the use of thermal vias, the thermal pad can
be directly connected to a power/ground plane or special heat sink structure designed into the PCB. On the
TPS2341, the die substrate is internally connected to the 12 V input supply. and therefore the power plane or
heatsink connected to the thermal pad on the bottom of the device must also connect to the 12 V input supply
(recommended) or float independent of any supply (acceptable).
The thermal performance can be modeled by determining the thermal resistance between the die and the
ambient environment. Thermal resistances are measures of how effectively an object dissipates heat. Typically,
the larger the device, the more surface area available for power dissipation and the lower the object’s thermal
resistance. Figure 12 illustrates the thermal path and resistances from the die, TJ through the printed circuit
board to the ambient air.
Solder
Copper
Trace
Via
Thermal Via
Heatsink/Copper Plane
Die
PD
(Watts)
Die Junction Temperature
Die Case Temperature
PCB Pad Temperature
PCB Heatsink Temperature
Ambient Air Temperature
UDG02156
TPS2341 48HTQFP PowerPAD
t
TJ
θJC
θCP
TC
TP
θPH
TH
θHA
TA
12 VIN or Floating
Figure 12. PowerPAD
t Thermal Model
Technical Brief PowerPAD
t Thermally Enhanced Package (SLMA002) can be used as a guide to model the
TPS2341 thermal resistance. The following example assumes the conditions as described in the technical brief.
The TPS2341, mounted to a copper pad with solder on a PCB and two ounce traces, should exhibit a thermal
resistance from junction temperature to ambient temperature of 29
_C/W.
相關PDF資料
PDF描述
TPS2343DDPG3 6-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO80
TPS2343DDPR 6-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO80
TPS2345PWNRND 4-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO24
TPS2346PWG4 4-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO24
TPS2350DRG4 1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO14
相關代理商/技術參數
參數描述
TPS2342PFP 功能描述:熱插拔功率分布 Hot Plug Power Controller RoHS:否 制造商:Texas Instruments 產品:Controllers & Switches 電流限制: 電源電壓-最大:7 V 電源電壓-最小:- 0.3 V 工作溫度范圍: 功率耗散: 安裝風格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Tube
TPS2342PFPG4 功能描述:熱插拔功率分布 Hot Plug Power Controller RoHS:否 制造商:Texas Instruments 產品:Controllers & Switches 電流限制: 電源電壓-最大:7 V 電源電壓-最小:- 0.3 V 工作溫度范圍: 功率耗散: 安裝風格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Tube
TPS2342PFPR 功能描述:熱插拔功率分布 Hot Plug Power Controller RoHS:否 制造商:Texas Instruments 產品:Controllers & Switches 電流限制: 電源電壓-最大:7 V 電源電壓-最小:- 0.3 V 工作溫度范圍: 功率耗散: 安裝風格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Tube
TPS2342PFPRG4 功能描述:熱插拔功率分布 Hot Plug Power Controller RoHS:否 制造商:Texas Instruments 產品:Controllers & Switches 電流限制: 電源電壓-最大:7 V 電源電壓-最小:- 0.3 V 工作溫度范圍: 功率耗散: 安裝風格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Tube
TPS2343DDP 功能描述:熱插拔功率分布 Dual Slot PCI-X 2.0 Hot-Plug Pwr Cntrlr RoHS:否 制造商:Texas Instruments 產品:Controllers & Switches 電流限制: 電源電壓-最大:7 V 電源電壓-最小:- 0.3 V 工作溫度范圍: 功率耗散: 安裝風格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Tube
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