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參數(shù)資料
| 型號： | TMP93CW41DF |
| 廠商： | Toshiba Corporation |
| 元件分類： | 微控制器 |
| 英文描述： | Lens Cap; Leaded Process Compatible:Yes RoHS Compliant: Yes |
| 中文描述： | 質(zhì)量與可靠性保證/操作注意事項 |
| 文件頁數(shù)： | 22/48頁 |
| 文件大?。?/td> | 390K |
| 代理商： | TMP93CW41DF |
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Quality and Reliability Assurance / Handling Precautions
030901
QUA-22
2002-02-20
(7) 68000 Series
Table 2.9 Storage conditions, permissible usage Period after unpacking and baking
requirements for each soldering method
Products
Name
Package no.
Air reflow
Infrared reflow
TMP68301AF-xx
TMP68301AKF-xx
TMP68303DF-xx
TMP68305F-xx
TMP68301AFR-xx
TMP68301AKFR-xx
TMP68HC003F-xx
TMP68204F-xx
Note 1:
P-QFP100-2222-0.80A
P-QFP100-2222-0.80A
P-QFP100-2222-0.80A
P-QFP100-2222-0.80A
P-QFP100-1420-0.65A
P-QFP100-1420-0.65A
P-QFP80-1420-0.80B
P-QFP160-2828-0.65A
As of February, 1998
A(168h)
A(168h)
G
A(168h)
A(168h)
A(168h)
A(168h)
G
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
Note 2:
Ensure that the conditions for top/bottom heating using the
long/medium infrared reflow method are strictly adhered to, even when
this method is used in combination with the air reflow method.
Symbols A (168h), B (72h), C (48h), D (24h), E(12h),
G
and
indicate
the maximum permissible period between unpacking and mounting of
the device, and the required storage conditions for the device. For
details of these conditions, please refer to Table 2.2.
Note 3:
(8) Z80 Series
Table 2.10 Storage conditions, permissible usage Period after unpacking and baking
requirements for each soldering method
Products
Name
Package no.
Air reflow
Infrared reflow
TMPZ84C011BF
TMPZ84C015BF
TMPZ84C013AT
TMPZ84C112AF
TMPZ84C711AF
TMPZ84C810AF
Note 1:
P-QFP100-1420-0.65A
P-QFP100-1420-0.65A
P-QFJ84-S115-1.27
P-QFP64-1420-1.00A
P-QFP144-2626-0.65B
P-QFP100-1420-0.65A
As of September, 1994
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
Note 2:
Ensure that the conditions for top/bottom heating using the
long/medium infrared reflow method are strictly adhered to, even when
this method is used in combination with the air reflow method.
Symbols A (168h), B (72h), C (48h), D (24h), E(12h),
G
and
indicate
the maximum permissible period between unpacking and mounting of
the device, and the required storage conditions for the device. For
details of these conditions, please refer to Table 2.2.
Note 3:
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TMP93CW41DF(JZ) | 制造商:Toshiba America Electronic Components 功能描述:MCU 16BIT TLCS-900 CISC ROMLESS 3.3V/5V 100LQFP - Bulk |
| TMP93CW41DF(Z) | 制造商:Toshiba America Electronic Components 功能描述:MCU 16BIT TLCS-900 CISC ROMLESS 3.3V/5V 100LQFP - Rail/Tube |
| TMP93CW41DFG(C,JZ) | 制造商:Toshiba America Electronic Components 功能描述: |
| TMP93CW41DFG(JOA) | 制造商:Toshiba America Electronic Components 功能描述:INTEGRATED CIRCUIT MICROCONTROLLER ROMLESS 16 BIT INTEGRATED - Bulk |
| TMP93CW41DFG(JZ) | 制造商:Toshiba America Electronic Components 功能描述:MCU 16BIT TLCS-900 CISC ROMLESS 3.3V/5V 100LQFP - Bulk |
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