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參數(shù)資料
| 型號： | TMP93CW41DF |
| 廠商： | Toshiba Corporation |
| 元件分類： | 微控制器 |
| 英文描述： | Lens Cap; Leaded Process Compatible:Yes RoHS Compliant: Yes |
| 中文描述： | 質(zhì)量與可靠性保證/操作注意事項 |
| 文件頁數(shù)： | 21/48頁 |
| 文件大?。?/td> | 390K |
| 代理商： | TMP93CW41DF |
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Quality and Reliability Assurance / Handling Precautions
030901
QUA-21
2002-02-20
Table 2.8 Storage conditions, permissible usage Period after unpacking and baking
requirements for each soldering method (3/3)
Products
Name
Package no.
Air reflow
Infrared reflow
TMP47C660AF
TMP47C860AF
TMP47P860VF
TMP47C1220F
TMP47C1620F
TMP47P1620VF
TMP47C1260F
TMP47C1660F
TMP47P1660VF
Note 1:
P-QFP64-1420-1.00A
P-QFP64-1420-1.00A
P-QFP64-1420-1.00A
P-QFP80-1420-0.80B
P-QFP80-1420-0.80B
P-QFP80-1420-0.80B
P-QFP64-1420-1.00A
P-QFP64-1420-1.00A
P-QFP64-1420-1.00A
As of March, 2001
Symbols A (168h), B (72h), C (48h), D (24h), E(12h),
G
and
indicate
the maximum permissible period between unpacking and mounting of
the device, and the required storage conditions for the device. For
details of these conditions, please refer to Table 2.2.
A(168h)
A(168h)
G
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
G
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
B(72h)
Note 2:
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TMP93CW41DF(JZ) | 制造商:Toshiba America Electronic Components 功能描述:MCU 16BIT TLCS-900 CISC ROMLESS 3.3V/5V 100LQFP - Bulk |
| TMP93CW41DF(Z) | 制造商:Toshiba America Electronic Components 功能描述:MCU 16BIT TLCS-900 CISC ROMLESS 3.3V/5V 100LQFP - Rail/Tube |
| TMP93CW41DFG(C,JZ) | 制造商:Toshiba America Electronic Components 功能描述: |
| TMP93CW41DFG(JOA) | 制造商:Toshiba America Electronic Components 功能描述:INTEGRATED CIRCUIT MICROCONTROLLER ROMLESS 16 BIT INTEGRATED - Bulk |
| TMP93CW41DFG(JZ) | 制造商:Toshiba America Electronic Components 功能描述:MCU 16BIT TLCS-900 CISC ROMLESS 3.3V/5V 100LQFP - Bulk |
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