參數(shù)資料
型號(hào)： TMP93C071F
廠商： Toshiba Corporation
元件分類(lèi)： 微控制器
英文描述： Quality And Reliability Assurance / Handling Precautions
中文描述： 質(zhì)量與可靠性保證/操作注意事項(xiàng)
文件頁(yè)數(shù)： 31/48頁(yè)
文件大小： 390K
代理商： TMP93C071F
Quality and Reliability Assurance / Handling Precautions
030901
QUA-31
2002-02-20
4.1.2 Vibration, Impact and Stress
Handle devices and packaging materials with care.
To avoid damage to devices, do not toss or drop
packages. Ensure that devices are not subjected to
mechanical vibration or shock during
transportation. Ceramic package devices and
devices in canister-type packages which have
empty space inside them are subject to damage
from vibration and shock because the bonding wires are secured only at their
ends.
Plastic molded devices, on the other hand, have a relatively high level of
resistance to vibration and mechanical shock because their bonding wires are
enveloped and fixed in resin. However, when any device or package type is
installed in target equipment, it is to some extent susceptible to wiring
disconnections and other damage from vibration, shock and stressed solder
junctions. Therefore when devices are incorporated into the design of
equipment which will be subject to vibration, the structural design of the
equipment must be thought out carefully.
If a device is subjected to especially strong vibration, mechanical shock or
stress, the package or the chip itself may crack. In products such as CCDs
which incorporate window glass, this could cause surface flaws in the glass or
cause the connection between the glass and the ceramic to separate.
Furthermore, it is known that stress applied to a semiconductor device
through the package changes the resistance characteristics of the chip because
of piezoelectric effects. In analog circuit design attention must be paid to the
problem of package stress as well as to the dangers of vibration and shock as
described above.
Vibration
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