- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄365844 > TMP91PW18AF (Toshiba Corporation) Quality And Reliability Assurance / Handling Precautions PDF資料下載
參數(shù)資料
| 型號(hào)： | TMP91PW18AF |
| 廠商： | Toshiba Corporation |
| 英文描述： | Quality And Reliability Assurance / Handling Precautions |
| 中文描述： | 質(zhì)量與可靠性保證/操作注意事項(xiàng) |
| 文件頁數(shù)： | 6/48頁 |
| 文件大?。?/td> | 390K |
| 代理商： | TMP91PW18AF |
第1頁第2頁第3頁第4頁第5頁當(dāng)前第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁
Quality and Reliability Assurance / Handling Precautions
030901
QUA-6
2002-02-20
Table 2.1 Recommended soldering methods and precautions when mounting
Soldering method
Localized heating
method
Mounting method
Soldering iron method
Mounting precaution
The recommended soldering conditions are as follows:
(1)
Standard:
EIAJ ED-4701A-133
Environment test, soldering heat-
resistance test (SMD)
(2)
Soldering method: Soldering (lead only)
(3)
Soldering condition: (a)at 350
°
C for up to 3 seconds.
(b)at 260
°
C for up to 10
seconds.
Wave soldering method
(Solder flow)
(1)
Apply preheating for 60 to 120 seconds at a
temperature of 150°C.
(2)
For lead insertion-type packages, complete
solder flow within 10 seconds with the
temperature at the stopper (or, if there is no
stopper, at a location more than 1.5 mm from the
body) which does not exceed 260°C.
(3)
For
surface-mount
soldering within 5 seconds at a temperature of
250°C or less in order to prevent thermal stress
in the device.
For details, contact your local Toshiba dealer.
Because thermal stress is severe, as with solder dipping,
the infrared reflow method is not recommended for some
products. For details, contact your local Toshiba dealer.
The recommended conditions for SMD reflow are as
follows:
(1)
Standard:
EIAJ ED-4701 A-133
Environment test
(2)
Soldering method: (a) Hot air reflow
(with optional far or middle
infrared reflow process)
(b) Far or middle infrared reflow
(3)
Pre-heating: 140 to 160
°
C, for 60 to 120 seconds.
(4)
Reflow:(a) 240
°
C max
(b) At more than 210
°
C, for 30 to 50 seconds.
(5)
Number of reflows: Maximum of two times within the
allowable period of use
The specified soldering temperatures are based on
the temperature of the package surface.
For a sample recommended temperature profile,
refer to Figure 2.1.
packages,
complete
Short infrared reflow
method
Overall heating method
Far or middle infrared
Hot air reflow
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| TMP93C071F | Quality And Reliability Assurance / Handling Precautions |
| TMP93CF76F | Quality And Reliability Assurance / Handling Precautions |
| TMP93CF77F | Quality And Reliability Assurance / Handling Precautions |
| TMP93CM40F | Quality And Reliability Assurance / Handling Precautions |
| TMP93CS20F | Quality And Reliability Assurance / Handling Precautions |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TMP92C820FG | 制造商:TOSHIBA 制造商全稱:Toshiba Semiconductor 功能描述:Original CMOS 16-Bit Microcontroller |
| TMP92CA25FG | 制造商:TOSHIBA 制造商全稱:Toshiba Semiconductor 功能描述:Original CMOS 32-Bit Microcontroller |
| TMP92CF26AXBG | 功能描述:32位微控制器 - MCU TLCS-900/H1 ROMLESS 144KB RAM RoHS:否 制造商:Texas Instruments 核心:C28x 處理器系列:TMS320F28x 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:90 MHz 程序存儲(chǔ)器大小:64 KB 數(shù)據(jù) RAM 大小:26 KB 片上 ADC:Yes 工作電源電壓:2.97 V to 3.63 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:LQFP-80 安裝風(fēng)格:SMD/SMT |
| TMP92CF29AFG | 制造商:Toshiba America Electronic Components 功能描述:DUMMY-TLCS-900/H1,ROMLESS 144KB, QFP, PB FREE, ACTIVE, - Trays |
| TMP92CF29AFG-7770 | 功能描述:32位微控制器 - MCU 32-Bit MCU 8 Timers 144Kb RAM 16Mb RoHS:否 制造商:Texas Instruments 核心:C28x 處理器系列:TMS320F28x 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:90 MHz 程序存儲(chǔ)器大小:64 KB 數(shù)據(jù) RAM 大小:26 KB 片上 ADC:Yes 工作電源電壓:2.97 V to 3.63 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:LQFP-80 安裝風(fēng)格:SMD/SMT |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。