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參數(shù)資料
| 型號： | TMP91PW18AF |
| 廠商： | Toshiba Corporation |
| 英文描述： | Quality And Reliability Assurance / Handling Precautions |
| 中文描述： | 質(zhì)量與可靠性保證/操作注意事項(xiàng) |
| 文件頁數(shù)： | 31/48頁 |
| 文件大?。?/td> | 390K |
| 代理商： | TMP91PW18AF |
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Quality and Reliability Assurance / Handling Precautions
030901
QUA-31
2002-02-20
4.1.2 Vibration, Impact and Stress
Handle devices and packaging materials with care.
To avoid damage to devices, do not toss or drop
packages. Ensure that devices are not subjected to
mechanical vibration or shock during
transportation. Ceramic package devices and
devices in canister-type packages which have
empty space inside them are subject to damage
from vibration and shock because the bonding wires are secured only at their
ends.
Plastic molded devices, on the other hand, have a relatively high level of
resistance to vibration and mechanical shock because their bonding wires are
enveloped and fixed in resin. However, when any device or package type is
installed in target equipment, it is to some extent susceptible to wiring
disconnections and other damage from vibration, shock and stressed solder
junctions. Therefore when devices are incorporated into the design of
equipment which will be subject to vibration, the structural design of the
equipment must be thought out carefully.
If a device is subjected to especially strong vibration, mechanical shock or
stress, the package or the chip itself may crack. In products such as CCDs
which incorporate window glass, this could cause surface flaws in the glass or
cause the connection between the glass and the ceramic to separate.
Furthermore, it is known that stress applied to a semiconductor device
through the package changes the resistance characteristics of the chip because
of piezoelectric effects. In analog circuit design attention must be paid to the
problem of package stress as well as to the dangers of vibration and shock as
described above.
Vibration
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參數(shù)描述 |
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| TMP92C820FG | 制造商:TOSHIBA 制造商全稱:Toshiba Semiconductor 功能描述:Original CMOS 16-Bit Microcontroller |
| TMP92CA25FG | 制造商:TOSHIBA 制造商全稱:Toshiba Semiconductor 功能描述:Original CMOS 32-Bit Microcontroller |
| TMP92CF26AXBG | 功能描述:32位微控制器 - MCU TLCS-900/H1 ROMLESS 144KB RAM RoHS:否 制造商:Texas Instruments 核心:C28x 處理器系列:TMS320F28x 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:90 MHz 程序存儲器大小:64 KB 數(shù)據(jù) RAM 大小:26 KB 片上 ADC:Yes 工作電源電壓:2.97 V to 3.63 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:LQFP-80 安裝風(fēng)格:SMD/SMT |
| TMP92CF29AFG | 制造商:Toshiba America Electronic Components 功能描述:DUMMY-TLCS-900/H1,ROMLESS 144KB, QFP, PB FREE, ACTIVE, - Trays |
| TMP92CF29AFG-7770 | 功能描述:32位微控制器 - MCU 32-Bit MCU 8 Timers 144Kb RAM 16Mb RoHS:否 制造商:Texas Instruments 核心:C28x 處理器系列:TMS320F28x 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:90 MHz 程序存儲器大小:64 KB 數(shù)據(jù) RAM 大小:26 KB 片上 ADC:Yes 工作電源電壓:2.97 V to 3.63 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:LQFP-80 安裝風(fēng)格:SMD/SMT |
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