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參數資料
| 型號： | TLP200G |
| 廠商： | 意法半導體 |
| 英文描述： | TRIPOLAR OVERVOLTAGE PROTECTION for TELECOM LINE |
| 中文描述： | 三極的電信線過電壓保護 |
| 文件頁數： | 14/14頁 |
| 文件大?。?/td> | 157K |
| 代理商： | TLP200G |
Printedcircuitboardmaterial
R
th
(j-a)
P Diss
1.FR4using the recommended pad-layout
50
°
C/W
1.5 W
2.FR4with heatsinkon board(6cm
2
)
35
°
C/W
2.0 W
3.FR4with copper-filledthroughholesand externalheatsinkapplied
12
°
C/W
5.8 W
4. IMSfloatingin air(40 cm
2
)
8
°
C/W
8.8 W
5. IMSwithexternalheatsinkapplied
3.5
°
C/W
20 W
TABLE1
A new technologyavailabletodayis IMS- an Insu-
lated Metallic Substrate. This offers greatly en-
hanced
thermal
characteristics
mount components. IMS is a substrateconsisting
of threedifferentlayers,(I)thebasematerialwhich
is availableas an aluminium or a copper plate,(II)
a thermal conductive dielectrical layer and (III) a
copper foil, which can be etched as a circuitlayer.
Using this material a thermal resistance of 8
°
C/W
with 40 cm
2
of board floating in air is achievable
(seefig.4).If evenhigherpower isto be dissipated
an externalheatsink could be appliedwhich leads
to an R
th
(j-a) of 3.5
°
C/W (see Fig. 5), assuming
that R
th
(heatsink-air) is equal to R
th
(junction-
heatsink). This is commonly applied in practice,
leading to reasonableheatsink dimensions. Often
power devices are defined by considering the
for
surface
maximum junction temperature of the device. In
practice , however,this is far frombeing exploited.
A summary of various power management capa-
bilities is made in table 1 based on a reasonable
deltaT of 70
°
Cjunctionto air.
The PowerSO-10 concept also represents an
attractive alternative to C.O.B. techniques.
PowerSO-10 offers devices fully tested at low
and high temperature. Mounting is simple - only
conventionalSMT is required - enabling the users
to getrid ofbond wireproblemsandtheproblemto
controlthe hightemperaturesoftsolderingaswell.
An optimized thermal managementis guaranteed
through PowerSO-10 as the power chips must in
any case be mounted on heat spreaders before
beingmountedonto the substrate.
Fig. 4 :
Mounting on metalbacked board
Fig. 5 :
Mounting on metal backed board with an
externalheatsinkapplied
FR4board
Copperfoil
Aluminium
heatsink
Copper foil
Insulation
Aluminium
Informationfurnished isbelieved to be accurate and reliable. However, STMicroelectronics assumes no responsibility for theconsequences of
use ofsuch informationnor forany infringementof patentsor other rightsof thirdparties which mayresult from its use. Nolicense is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change withoutnotice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems withoutexpress written ap-
proval ofSTMicroelectronics.
The ST logo is a registeredtrademark of STMicroelectronics
1998 STMicroelectronics - Printed in Italy - All rights reserved.
STMicroelectronics GROUP OF COMPANIES
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http://www.st.com
TLPxxM/G/G-1
14/14
相關PDF資料 |
PDF描述 |
|---|---|
| TLP200M | TRIPOLAR OVERVOLTAGE PROTECTION for TELECOM LINE |
| TLP140G | TRIPOLAR OVERVOLTAGE PROTECTION for TELECOM LINE |
| TLP270G | TRIPOLAR OVERVOLTAGE PROTECTION for TELECOM LINE |
| TLP270M | Computers, Hardware Leaded Process Compatible:No; Peak Reflow Compatible (260 C):No |
| TLP200G-1 | PT 19C 19#20 SKT RECP |
相關代理商/技術參數 |
參數描述 |
|---|---|
| TLP200G-1 | 功能描述:TVS 二極管 - 瞬態(tài)電壓抑制器 200V 50uA Tripolar RoHS:否 制造商:Vishay Semiconductors 極性:Bidirectional 工作電壓: 擊穿電壓:58.9 V 鉗位電壓:77.4 V 峰值浪涌電流:38.8 A 系列: 封裝 / 箱體:DO-214AB 最小工作溫度:- 55 C 最大工作溫度:+ 150 C |
| TLP200M | 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:TRIPOLAR OVERVOLTAGE PROTECTION for TELECOM LINE |
| TLP202A | 制造商:TOSHIBA 制造商全稱:Toshiba Semiconductor 功能描述:TOSHIBA Photocoupler Photorelay |
| TLP202A(F) | 功能描述:MOSFET輸出光電耦合器 Photorelay 2-Form-A VOFF=60V 0.5A 50ohm RoHS:否 制造商:Fairchild Semiconductor 每芯片的通道數量:1 Channel 輸出設備:Photo MOSFET 絕緣電壓:5000 Vrms 正向電流: 最大工作溫度:+ 100 C 最小工作溫度:- 40 C 封裝:Reel |
| TLP202A(TP,F) | 功能描述:固態(tài)繼電器-PCB安裝 Photorelay Voff=60V Ion=0.5/0.4A RoHS:否 制造商:Omron Electronics 控制電壓范圍: 負載電壓額定值:40 V 負載電流額定值:120 mA 觸點形式:1 Form A (SPST-NO) 輸出設備:MOSFET 封裝 / 箱體:USOP-4 安裝風格:SMD/SMT |
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