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參數(shù)資料
| 型號： | TLP200G |
| 廠商： | 意法半導(dǎo)體 |
| 英文描述： | TRIPOLAR OVERVOLTAGE PROTECTION for TELECOM LINE |
| 中文描述： | 三極的電信線過電壓保護 |
| 文件頁數(shù)： | 12/14頁 |
| 文件大?。?/td> | 157K |
| 代理商： | TLP200G |
SOLDERINGRECOMMENDATION
The soldering process causes considerable ther-
mal stress to a semiconductor component. This
has to be minimized to assure a reliable and ex-
tended lifetime of the device. The PowerSO-10
package can be exposedto a maximum tempera-
ture of 260
°
C for 10 seconds. However a proper
soldering of the package could be done at 215
°
C
for 3 seconds. Any solder temperature profile
shouldbe withinthese limits. Asreflowtechniques
are most common in surface mounting, typical
heating profiles are given in Figure 1,either for
mounting on FR4 or on metal-backedboards. For
each particular board, the appropriateheat profile
has to be adjusted experimentally. The present
proposalisjusta startingpoint.In anycase,thefol-
lowingprecautionshaveto be considered:
- alwayspreheatthe device
- peaktemperatureshould be at least30
°
C
higherthanthe meltingpointof thesolder
alloychosen
- thermalcapacityof the basesubstrate
Voids pose a difficult reliability problem for large
surface mount devices. Such voids under the
package result in poor thermal contact and the
high thermal resistance leads to component fail-
ures.The PowerSO-10is designedfromscratchto
be solelya surfacemountpackage,hencesymme-
try inthe x- and y-axisgivesthe packageexcellent
weight balance.Moreover, the PowerSO-10offers
the unique possibility to control easily the flatness
and quality of the soldering process. Both the top
and the bottomsolderededgesof thepackageare
accessible for visual inspection (soldering menis-
cus).
Coplanarity between the substrate and the pack-
age can beeasilyverified. The qualityof the solder
joints is very important for two reasons : (I) poor
quality solder joints result directlyin poor reliability
and (II) solder thickness affects the thermal resis-
tance significantly. Thus a tight control of this pa-
rameter results in thermally efficient and reliable
solderjoints.
Fig. 1 :
Typicalreflow solderingheatprofile
Time (s)
Temperature ( C)
0
40
80
120
160
200
240
280
320
360
0
50
100
150
200
250
o
215 C
Soldering
Preheating
Cooling
245 C
Epoxy FR4
board
Metal-backed
board
TLPxxM/G/G-1
12/14
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| TLP200M | TRIPOLAR OVERVOLTAGE PROTECTION for TELECOM LINE |
| TLP140G | TRIPOLAR OVERVOLTAGE PROTECTION for TELECOM LINE |
| TLP270G | TRIPOLAR OVERVOLTAGE PROTECTION for TELECOM LINE |
| TLP270M | Computers, Hardware Leaded Process Compatible:No; Peak Reflow Compatible (260 C):No |
| TLP200G-1 | PT 19C 19#20 SKT RECP |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TLP200G-1 | 功能描述:TVS 二極管 - 瞬態(tài)電壓抑制器 200V 50uA Tripolar RoHS:否 制造商:Vishay Semiconductors 極性:Bidirectional 工作電壓: 擊穿電壓:58.9 V 鉗位電壓:77.4 V 峰值浪涌電流:38.8 A 系列: 封裝 / 箱體:DO-214AB 最小工作溫度:- 55 C 最大工作溫度:+ 150 C |
| TLP200M | 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:TRIPOLAR OVERVOLTAGE PROTECTION for TELECOM LINE |
| TLP202A | 制造商:TOSHIBA 制造商全稱:Toshiba Semiconductor 功能描述:TOSHIBA Photocoupler Photorelay |
| TLP202A(F) | 功能描述:MOSFET輸出光電耦合器 Photorelay 2-Form-A VOFF=60V 0.5A 50ohm RoHS:否 制造商:Fairchild Semiconductor 每芯片的通道數(shù)量:1 Channel 輸出設(shè)備:Photo MOSFET 絕緣電壓:5000 Vrms 正向電流: 最大工作溫度:+ 100 C 最小工作溫度:- 40 C 封裝:Reel |
| TLP202A(TP,F) | 功能描述:固態(tài)繼電器-PCB安裝 Photorelay Voff=60V Ion=0.5/0.4A RoHS:否 制造商:Omron Electronics 控制電壓范圍: 負載電壓額定值:40 V 負載電流額定值:120 mA 觸點形式:1 Form A (SPST-NO) 輸出設(shè)備:MOSFET 封裝 / 箱體:USOP-4 安裝風(fēng)格:SMD/SMT |
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