參數(shù)資料
型號(hào)： TLP200G
廠商： 意法半導(dǎo)體
英文描述： TRIPOLAR OVERVOLTAGE PROTECTION for TELECOM LINE
中文描述： 三極的電信線過電壓保護(hù)
文件頁(yè)數(shù)： 13/14頁(yè)
文件大?。?/td> 157K
代理商： TLP200G
SUBSTRATESAND MOUNTINGINFORMATION
The use of epoxyFR4 boardsis quite common for
surface mounting techniques,however, their poor
thermal conductioncompromisesthe
outstandingthermalperformanceof thePowerSO-
10. Some methodsto overcome thislimitation are
discussedbelow.
One possibility to improve the thermal conduction
is the use of large heat spreaderareas at thecop-
per layerofthePC board.Thisleadsto areduction
of thermal resistance to 35
°
C for 6 cm
2
of the
board heatsink(seefig.2).
Use of copper-filledthroughholes on conventional
FR4 techniqueswill increase the metallization and
otherwise
decrease thermal resistance accordingly. Using
a configurationwith 16holesunderthe spreaderof
the packagewith a pitchof 1.8 mm anda diameter
of 0.7 mm, the thermal resistance (junction -
heatsink) can be reduced to 12
°
C/W (see fig. 3).
Besidethe thermaladvantage,thissolutionallows
multi-layer boards to be used. However, a draw-
back of this traditional material prevents its use in
veryhighpower,highcurrentcircuits.Forinstance,
it is not advisable to surface mount devices with
currents greater than 10 A on FR4 boards. A
PowerMosfetor Schottkydiodeinasurfacemount
power package can handle up to around 50 A if
bettersubstratesare used.
Fig.2 :
Mountingon epoxyFR4head dissipationbyextendingthe area of thecopper layer
Fig. 3 :
Mountingon epoxyFR4 byusing copper-filledthroughholesfor heattransfer
FR4 board
Copper foil
FR4board
Copperfoil
heattransfer
heatsink
TLPxxM/G/G-1
13/14
相關(guān)PDF資料
PDF描述
TLP200M TRIPOLAR OVERVOLTAGE PROTECTION for TELECOM LINE
TLP140G TRIPOLAR OVERVOLTAGE PROTECTION for TELECOM LINE
TLP270G TRIPOLAR OVERVOLTAGE PROTECTION for TELECOM LINE
TLP270M Computers, Hardware Leaded Process Compatible:No; Peak Reflow Compatible (260 C):No
TLP200G-1 PT 19C 19#20 SKT RECP
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
TLP200G-1 功能描述:TVS 二極管 - 瞬態(tài)電壓抑制器 200V 50uA Tripolar RoHS:否 制造商:Vishay Semiconductors 極性:Bidirectional 工作電壓: 擊穿電壓:58.9 V 鉗位電壓:77.4 V 峰值浪涌電流:38.8 A 系列: 封裝 / 箱體:DO-214AB 最小工作溫度:- 55 C 最大工作溫度:+ 150 C
TLP200M 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:TRIPOLAR OVERVOLTAGE PROTECTION for TELECOM LINE
TLP202A 制造商:TOSHIBA 制造商全稱:Toshiba Semiconductor 功能描述:TOSHIBA Photocoupler Photorelay
TLP202A(F) 功能描述:MOSFET輸出光電耦合器 Photorelay 2-Form-A VOFF=60V 0.5A 50ohm RoHS:否 制造商:Fairchild Semiconductor 每芯片的通道數(shù)量:1 Channel 輸出設(shè)備:Photo MOSFET 絕緣電壓:5000 Vrms 正向電流: 最大工作溫度:+ 100 C 最小工作溫度:- 40 C 封裝:Reel
TLP202A(TP,F) 功能描述:固態(tài)繼電器-PCB安裝 Photorelay Voff=60V Ion=0.5/0.4A RoHS:否 制造商:Omron Electronics 控制電壓范圍: 負(fù)載電壓額定值:40 V 負(fù)載電流額定值:120 mA 觸點(diǎn)形式:1 Form A (SPST-NO) 輸出設(shè)備:MOSFET 封裝 / 箱體:USOP-4 安裝風(fēng)格:SMD/SMT
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