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參數(shù)資料
| 型號(hào)： | TJA1020 |
| 廠商： | NXP Semiconductors N.V. |
| 元件分類： | 標(biāo)準(zhǔn)邏輯 |
| 英文描述： | LIN transceiver |
| 中文描述： | LIN收發(fā)器 |
| 文件頁(yè)數(shù)： | 20/24頁(yè) |
| 文件大小： | 105K |
| 代理商： | TJA1020 |
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2002 Jul 17
20
Philips Semiconductors
Product specification
LIN transceiver
TJA1020
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1.
For more detailed information on the BGA packages refer to the“(LF)BGA Application Note” (AN01026); order a copy
from your Philips Semiconductors sales office.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2.
3.
4.
5.
6.
PACKAGE
(1)
SOLDERING METHOD
WAVE
REFLOW
(2)
BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA
HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN,
HVSON, SMS
PLCC
(4)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
not suitable
not suitable
(3)
suitable
suitable
suitable
not recommended
(4)(5)
not recommended
(6)
suitable
suitable
suitable
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TJA1020_5 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:LIN transceiver |
| TJA1020T | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:LIN transceiver |
| TJA1020T/CM,118 | 制造商:NXP Semiconductors 功能描述:TJA1020T/SO8/REEL13//CM - Tape and Reel 制造商:NXP Semiconductors 功能描述:IC TRANSCEIVER LIN 8SOIC 制造商:NXP Semiconductors 功能描述:TJA1020 Series 12 V 4 kV ESD 20 kBaud LIN Transceiver Surface Mount - SOIC-8 制造商:NXP 功能描述:LIN transceiver; SO8 (Replacement to TJA1020T/VM) |
| TJA1020T/N,112 | 功能描述:射頻收發(fā)器 LIN TRANSCEIVER RoHS:否 制造商:Atmel 頻率范圍:2322 MHz to 2527 MHz 最大數(shù)據(jù)速率:2000 Kbps 調(diào)制格式:OQPSK 輸出功率:4 dBm 類型: 工作電源電壓:1.8 V to 3.6 V 最大工作溫度:+ 85 C 接口類型:SPI 封裝 / 箱體:QFN-32 封裝:Tray |
| TJA1020T/N,118 | 功能描述:射頻收發(fā)器 LIN TRANSCEIVER RoHS:否 制造商:Atmel 頻率范圍:2322 MHz to 2527 MHz 最大數(shù)據(jù)速率:2000 Kbps 調(diào)制格式:OQPSK 輸出功率:4 dBm 類型: 工作電源電壓:1.8 V to 3.6 V 最大工作溫度:+ 85 C 接口類型:SPI 封裝 / 箱體:QFN-32 封裝:Tray |
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