參數(shù)資料
型號： THS6032DWP
廠商： Texas Instruments, Inc.
英文描述： LOW-POWER ADSL CENTRAL-OFFICE LINE DRIVER
中文描述： 低功耗寬帶局端線路驅(qū)動器
文件頁數(shù)： 4/31頁
文件大?。?/td> 496K
代理商： THS6032DWP
THS6032
LOW-POWER ADSL CENTRAL-OFFICE LINE DRIVER
SLOS233C – APRIL1999 – REVISED MARCH 2000
4
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
functional block diagram (SOIC package)
VCCL+
DGND
–
+
VCCH+
2OUT
19
18
17
16
15
12
2IN–
2IN+
1OUT
1IN–
1IN+
VCCL–
VCCH–
SHDN1
SHDN2
8
9
5
6
3
2
4
–
+
NOTE A: Terminals 1, 10, 11, and 20 are internally connected to the thermal pad.
absolute maximum ratings over operating free-air temperature (unless otherwise noted)
Supply voltage, V
CC(L)
and V
CC(H)
(see Note 1)
Input voltage, V
I
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output current, I
O
(see Note 2)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Differential input voltage, V
ID
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Total power dissipation at (or below) 25
°
C free-air temperature
(see Note 2)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Maximum junction temperature, T
J
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating free-air temperature, T
A
, C-suffix
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
I-suffix
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature, T
stg
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature 1,6 mm (1/16 in) from case for 10 seconds
33 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
±
V
CCH
800 mA
±
4 V
See Dissipation Rating Table
150
°
C
0
°
C to 70
°
C
–40
°
C to 85
°
C
–65
°
C to 125
°
C
300
°
C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES:
1. VCC(L) must always be less than or equal to VCC(H)
2. The THS6032 incorporates a PowerPAD on the underside of the chip. This acts as a heatsink and must be connected to a thermally
dissipative plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature which
could permanently damage the device. See the Thermal Information section for more information about utilizing the PowerPAD
thermally enhanced packages.
DISSIPATION RATING TABLE
PACKAGE
θ
JA
(
°
C/W)
θ
JC
(
°
C/W)
TA = 25
°
C
POWER RATING
DWP
21.5
0.37
5.8 W
GQE
37.8
4.56
3.3 W
This data was taken using 2 oz. trace and copper pad that is soldered directly to a JEDEC
standard 4 layer 3 in
×
3 in PCB.
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