參數(shù)資料
型號: THS6032DWP
廠商: Texas Instruments, Inc.
英文描述: LOW-POWER ADSL CENTRAL-OFFICE LINE DRIVER
中文描述: 低功耗寬帶局端線路驅(qū)動器
文件頁數(shù): 17/31頁
文件大?。?/td> 496K
代理商: THS6032DWP
THS6032
LOW-POWER ADSL CENTRAL-OFFICE LINE DRIVER
SLOS233C – APRIL1999 – REVISED MARCH 2000
17
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
APPLICATION INFORMATION
thermal information (continued)
The actual thermal performance achieved with the THS6032 in its PowerPAD package depends on the
application. In the previous example, if the size of the internal ground plane is approximately 3 inches
×
3 inches,
then the expected thermal coefficient,
θ
JA
,
is
about 21.5
°
C/W for the DWP package and 37.8
°
C/W for the GQE
package. For a given
θ
JA
, the maximum power dissipation is shown in Figure 40 and is calculated by the
following formula:
PD
TMAX–TA
JA
Where:
P
D
T
MAX
= Absolute maximum junction temperature (150
°
C)
T
A
= Free-ambient air temperature (
°
C)
θ
JA
=
θ
JC
+
θ
CA
θ
JC
= Thermal coefficient from junction to case (DWP =0.37
°
C/W; GQE = 4.56
°
C/W)
θ
CA
= Thermal coefficient from case to ambient
= Maximum power dissipation of THS6032 (watts)
TA – Free-Air Temperature –
°
C
–40
–20
0
20
80
100
60
40
MAXIMUM POWER DISSIPATION
vs
FREE-AIR TEMPERATURE
5
3
1
0
4
2
6
7
M
8
9
TJ = 150
°
C
PCB Size = 3” x 3”
No Air Flow
DWP
θ
JA = 21.5
°
C/W
2 oz Trace and
Copper Pad
with Solder
DWP
θ
JA = 43.9
°
C/W
2 oz Trace and Copper Pad
without Solder
GQE
Figure 40. Maximum Power Dissipation vs Free-Air Temperature
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