參數(shù)資料
型號(hào)： THS6032DWP
廠商： Texas Instruments, Inc.
英文描述： LOW-POWER ADSL CENTRAL-OFFICE LINE DRIVER
中文描述： 低功耗寬帶局端線路驅(qū)動(dòng)器
文件頁數(shù)： 16/31頁
文件大小： 496K
代理商： THS6032DWP
THS6032
LOW-POWER ADSL CENTRAL-OFFICE LINE DRIVER
SLOS233C – APRIL1999 – REVISED MARCH 2000
16
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
APPLICATION INFORMATION
thermal information (continued)
The THS6032 is also available in the MicroStar Junior GQE package. Just like the DWP package, the GQE
package utilizes the PowerPAD functionality to improve thermal performance. The GQE package is part of the
new ball-grid array (BGA) family developed by Texas Instruments (TI
). This package allows for even higher
density layouts with virtually no loss in thermal performance. Its construction is similar to the DWP construction
(see Figure 39 (a) and (b)), but utilizes the BGA’s to transfer the heat away from the die.
(TOP VIEW)
(a)
(b)
NOTE: Shaded areas are part of the thermally conductive path.
Die
(Side VIEW)
Figure 39. Views of Thermally Enhanced GQE Package
The PowerPAD packages allows for both assembly and thermal management in one manufacturing operation.
During the surface-mount solder operation (when the leads or balls are being soldered), the thermal areas can
also be soldered to a copper area underneath the package. Through the use of thermal paths within this copper
area, heat can be conducted away from the package into either a ground plane or other heat dissipating device.
This is discussed in more detail in the PCB design considerationssection of this document.
The PowerPAD package represents a breakthrough in combining the small area and ease of assembly of
surface mount with the, heretofore, awkward mechanical methods of heatsinking.
Because of its power dissipation, proper thermal management of the THS6032 is required. There are several
ways to properly heatsink both the DWP and GQE packages. There are several TI application notes on how
to best accomplish the thermal mounting scheme required for each package. For the DWP package, refer to
the Texas Instruments Technical Brief, PowerPAD Thermally Enhanced Package literature number SLMA002.
There is also a more compact technical paper entitled PowerPad Made Easy literature number SLMA004. For
the GQE – MicroStar Junior package, refer to the MicroStar BGA Packaging Reference Guide literature number
SSYZ015A and the compact version entitled MicroStar Junior Made Easy literature number SSYA009. This
literature is available on TI’s web site at http://www.ti.com.
TI is a trademark of Texas Instruments Incorporated.
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參數(shù)描述
THS6032EVM 功能描述:放大器 IC 開發(fā)工具 THS6032 Hi-Spd Amp Eval Mods RoHS:否 制造商:International Rectifier 產(chǎn)品:Demonstration Boards 類型:Power Amplifiers 工具用于評(píng)估:IR4302 工作電源電壓:13 V to 23 V
THS6032GQE 制造商:TI 制造商全稱:Texas Instruments 功能描述:LOW-POWER ADSL CENTRAL-OFFICE LINE DRIVER
THS6032GQEEVM 制造商:TI 制造商全稱:Texas Instruments 功能描述:LOW-POWER ADSL CENTRAL-OFFICE LINE DRIVER
THS6032IDWP 功能描述:緩沖器和線路驅(qū)動(dòng)器 Low-Pwr ADSL Cent-Office Line Drv RoHS:否 制造商:Micrel 輸入線路數(shù)量:1 輸出線路數(shù)量:2 極性:Non-Inverting 電源電壓-最大:+/- 5.5 V 電源電壓-最小:+/- 2.37 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Reel
THS6032IDWPG4 功能描述:緩沖器和線路驅(qū)動(dòng)器 Low-Pwr ADSL Cent-Office Line Drv RoHS:否 制造商:Micrel 輸入線路數(shù)量:1 輸出線路數(shù)量:2 極性:Non-Inverting 電源電壓-最大:+/- 5.5 V 電源電壓-最小:+/- 2.37 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Reel
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