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參數(shù)資料
| 型號(hào)： | TE28F800C3TD70 |
| 廠商： | INTEL CORP |
| 元件分類(lèi)： | PROM |
| 英文描述： | 512K X 16 FLASH 3V PROM, 70 ns, PDSO48 |
| 封裝： | 12 X 20 MM, TSOP-48 |
| 文件頁(yè)數(shù)： | 6/72頁(yè) |
| 文件大?。?/td> | 1083K |
| 代理商： | TE28F800C3TD70 |
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Intel Advanced+ Boot Block Flash Memory (C3)
May 2005
Intel Advanced+ Boot Block Flash Memory (C3)
Datasheet
14
Order Number: 290645, Revision: 023
3.3
Easy BGA Package
Figure 4.
Easy BGA Package Drawing and Dimension
Millimeters
Inches
Symbol
Min
Nom
Max
Notes
Min
Nom
Max
Package Height
A
1.200
0.0472
Ball Height
A1
0.250
0.0098
Package Body Thickness
A2
0.780
0.0307
Ball (Lead) Width
b
0.330
0.430
0.530
0.0130
0.0169
0.0209
Package Body Width
D
9.900
10.000
10.100
1
0.3898
0.3937
0.3976
Package Body Length
E
12.900
13.000
13.100
1
0.5079
0.5118
0.5157
Pitch
[e]
1.000
0.0394
Ball (Lead) Count
N
64
Seating Plane Coplanarity
Y
0.100
0.0039
Corner to Ball A1 Distance Along D
S1
1.400
1.500
1.600
1
0.0551
0.0591
0.0630
Corner to Ball A1 Distance Along E
S2
2.900
3.000
3.100
1
0.1142
0.1181
0.1220
Dimensions Table
Note: (1) Package dimensions are for reference only. These dimensions are estimates based
on die size, and are subject to change.
E
Seating
Plane
S1
S2
e
Top View - Ball side down
Bottom View - Ball Side Up
Y
A
A1
D
Ball A1
Corner
A2
Note: Drawing not to scale
A
B
C
D
E
F
G
H
8
765
432
1
8
7
6
5
4
3
2
1
A
B
C
D
E
F
G
H
b
Ball A1
Corner
Side View
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