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參數(shù)資料
| 型號(hào)： | TDA8939 |
| 廠(chǎng)商： | NXP Semiconductors N.V. |
| 英文描述： | Zero dead time Class-D 7.5 A power comparator |
| 中文描述： | 零死時(shí)間D類(lèi)7.5甲功率比較 |
| 文件頁(yè)數(shù)： | 18/21頁(yè) |
| 文件大?。?/td> | 99K |
| 代理商： | TDA8939 |
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9397 750 13023
Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Objective data sheet
Rev. 01 — 22 April 2004
18 of 21
Philips Semiconductors
TDA8939
Zero dead time Class-D 7.5 A power comparator
[4]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
[5]
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6]
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7]
Wave soldering is suitable for SSOP, TSSOP, VSO and VSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[8]
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
[9]
Hot bar soldering or manual soldering is suitable for PMFP packages.
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