參數(shù)資料
型號(hào)： TDA8931
廠(chǎng)商： NXP Semiconductors N.V.
英文描述： Power comparator 1 X 20 W
中文描述： 功率比較1 × 20瓦
文件頁(yè)數(shù)： 26/31頁(yè)
文件大?。?/td> 165K
代理商： TDA8931
9397 750 13847
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Preliminary data sheet
Rev. 01 — 14 January 2004
26 of 31
Philips Semiconductors
TDA8931
Power comparator 1
×
20 W
17. Soldering
17.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account of
soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is recommended.
17.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement. Driven by legislation and
environmental forces the worldwide use of lead-free solder pastes is increasing.
Several methods exist for reflowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and cooling)
vary between 100 seconds and 200 seconds depending on heating method.
Typical reflow peak temperatures range from 215
°
C to 270
°
C depending on solder paste
material. The top-surface temperature of the packages should preferably be kept:
below 225
°
C (SnPb process) or below 245
°
C (Pb-free process)
–
for all BGA, HTSSON..T and SSOP..T packages
–
for packages with a thickness
≥
2.5 mm
–
for packages with a thickness < 2.5 mm and a volume
≥
350 mm
3
so called
thick/large packages.
below 240
°
C (SnPb process) or below 260
°
C (Pb-free process) for packages with a
thickness < 2.5 mm and a volume < 350 mm
3
so called small/thin packages.
Moisture sensitivity precautions, as indicated on packing, must be respected at all times.
17.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically
developed.
If wave soldering is used the following conditions must be observed for optimal results:
Use a double-wave soldering method comprising a turbulent wave with high upward
pressure followed by a smooth laminar wave.
For packages with leads on two sides and a pitch (e):
–
larger than or equal to 1.27 mm, the footprint longitudinal axis is
preferred
to be
parallel to the transport direction of the printed-circuit board;
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TDA8931T/N1,112 功能描述:校驗(yàn)器 IC 1 CHAN CLASS D AMPLIFIER 1X15W RoHS:否 制造商:STMicroelectronics 產(chǎn)品: 比較器類(lèi)型: 通道數(shù)量: 輸出類(lèi)型:Push-Pull 電源電壓-最大:5.5 V 電源電壓-最小:1.1 V 補(bǔ)償電壓（最大值）:6 mV 電源電流（最大值）:1350 nA 響應(yīng)時(shí)間: 最大工作溫度:+ 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SC-70-5 封裝:Reel
TDA8931T/N1,118 功能描述:校驗(yàn)器 IC 1 CHAN CLASS D AMPLIFIER 1X15W RoHS:否 制造商:STMicroelectronics 產(chǎn)品: 比較器類(lèi)型: 通道數(shù)量: 輸出類(lèi)型:Push-Pull 電源電壓-最大:5.5 V 電源電壓-最小:1.1 V 補(bǔ)償電壓（最大值）:6 mV 電源電流（最大值）:1350 nA 響應(yīng)時(shí)間: 最大工作溫度:+ 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SC-70-5 封裝:Reel
TDA8931T-T 功能描述:校驗(yàn)器 IC 1 CHAN CLASS D AMP 1X15W RoHS:否 制造商:STMicroelectronics 產(chǎn)品: 比較器類(lèi)型: 通道數(shù)量: 輸出類(lèi)型:Push-Pull 電源電壓-最大:5.5 V 電源電壓-最小:1.1 V 補(bǔ)償電壓（最大值）:6 mV 電源電流（最大值）:1350 nA 響應(yīng)時(shí)間: 最大工作溫度:+ 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SC-70-5 封裝:Reel
TDA8932 制造商:PHILIPS 制造商全稱(chēng):NXP Semiconductors 功能描述:2x15W class D Power Amplifier （PHILIPS的數(shù)字功放音質(zhì)好，沒(méi)有其它數(shù)字功放很濃的金屬聲）
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