參數(shù)資料
型號(hào)： TDA8512
廠商： NXP Semiconductors N.V.
英文描述： 26 W BTL and 2 x 13 W SE or 4 x 13 W SE power amplifier
中文描述： 26糯橋接和2 x 13 W功率SE或4 × 13 W功率東南功率放大器
文件頁(yè)數(shù)： 21/24頁(yè)
文件大?。?/td> 165K
代理商： TDA8512
2001 Nov 16
21
Philips Semiconductors
Preliminary specification
26 W BTL and 2
×
13 W SE or
4
×
13 W SE power amplifier
TDA8512J
16 SOLDERING
16.1
Introduction to soldering through-hole mount
packages
This text gives a brief insight to wave, dip and manual
soldering.Amorein-depth account ofsoldering ICscanbe
found in our “Data Handbook IC26; Integrated Circuit
Packages”(document order number 9398 652 90011).
Wave soldering is the preferred method for mounting of
through-hole mount IC packages on a printed-circuit
board.
16.2
Soldering by dipping or by solder wave
The maximum permissible temperature of the solder is
260
°
C; solder at this temperature must not be in contact
with the joints for more than 5 seconds.
Thetotalcontacttimeofsuccessivesolderwavesmustnot
exceed 5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
stg(max)
). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
16.3
Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300
°
C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400
°
C, contact may be up to 5 seconds.
16.4
Suitability of through-hole mount IC packages for dipping and wave soldering methods
Note
1.
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
PACKAGE
SOLDERING METHOD
DIPPING
WAVE
DBS, DIP, HDIP, SDIP, SIL
suitable
suitable
(1)
相關(guān)PDF資料
PDF描述
TDA8512J 26 W BTL and 2 x 13 W SE or 4 x 13 W SE power amplifier
TDA8540T 4 X 4 video switch matrix
TDA8540 4 X 4 video switch matrix
TDA8542AT 2 x 1.5 W BTL audio amplifier
TDA8542 2 x 1 W BTL audio amplifier
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
TDA8512J 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:26 W BTL and 2 x 13 W SE or 4 x 13 W SE power amplifier
TDA8512J/N1,112 功能描述:音頻放大器 4X16W SE/BTL FLEX RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
TDA8512JU 功能描述:音頻放大器 4X16W SE/BTL FLEX CHANNEL AMP RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
TDA8540 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:4 X 4 video switch matrix
TDA8540T 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:4 X 4 video switch matrix
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫(xiě)一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*